Technologies >MEMS > Pricing

 

  Europractice MEMS MPW runs – Pricelist 2017  
  General conditions  
      
  • Accessible for universities and research institutes.
    (Companies should contact the foundry directly.)
  • Prices and conditions may change at any time without prior notice.
  • Depending on run participation or the number of submissions the schedule can be adapted or runs may be cancelled.
     

 

  EU-Discounted Price
only applies to EUROPRACTICE registered (who paid their annual full membership fee) Academic and Research Members from all 28 EU countries and Albania, Armenia, Azerbaijan, Belarus, Bosnia-Herzegovina, Georgia, Iceland, Israel, Liechtenstein, Former Yugoslav Republic of Macedonia, Moldova, Montenegro, Norway, Russia, Switzerland, Turkey, Serbia and Ukraine who submit designs for educational or publicly funded research use only
     
  Standard Price
normal price for universities and research institutes that don't belong to previous category.
(Companies should contact the foundry directly)

 

  Number of prototypes (per location)
    MEMSCAP MUMPs:
    - Standard: 15 samples delivered (included in "Die Site" price)
    - Extra dies: 1500 € per group of 15 extra dies
    Teledyne Dalsa MIDIS:
    - Standard: 40 samples delivered
   
  Plots
    You can order plots of your designs
   - first plot costs 50 euro
   - next plots cost 20 euro each
   
  Packaging
    For MEMS, packaging is not available.
   
  PRICES IN EURO, except where otherwise indicated
    Prices are given for the delivery of unpackaged, untested prototypes.
      
     
     
     Technology specific conditions  
 

 

  MEMSCAP MUMPs
  PolyMUMPs
  SOIMUMPs
  PiezoMUMPs

 

PolyMUMPs, SOIMUMPs, PiezoMUMPs

Standard Price

EU-Discounted Price

For 1 location "Standard Die Site"

4200 €

3990 €

  • For each design submitted (one location), Memscap delivers 15 dies.
  • Extra dies: 1500 € per group of 15 extra dies
  • Optional Post-Processing:
      - Subdicing (PolyMUMPs): 200 € per cut per 15 die of any size from the same die location
      - Laser dicing (only on SOIMUMPs): (per 15 die from the same die location)
             * 1050 € for 1 or 2 equal cuts
             * 1600 € for 2 non-equal cuts
      - HF Release: 800 € for up to 15 die of any size from the same die location
      - Supercritical CO2 Dry + HF Release: 1800 € for up to 15 die of any size from the same die location
      Note that available post-processing options depend on technology: see table below

 

Chip Characteristics & Available Post-Processing Options

 

PolyMUMPs

SOIMUMPs

PiezoMUMPs

Die size (mm²)

10x10

11x11

Available active area (mm²)

9.8x9.8

9x9

9x9

Number of dies delivered

15

Optional Post-Processing

Subdicing (per cut per 15 die of any size from the same die location)

200 €

by design or optional laser dicing
1050 € ,
1600 €

by design or optional laser dicing
1050 € ,
1600 €

HF Release (for up to 15 die of any size from the same die location)

800 €

Not available
(structures are standard released)

Not available
(structures are standard released)

Supercritical CO2 Dry + HF Release (for up to 15 die of any size from the same die location)

1800 €

Not available
(structures are standard released)

Not available
(structures are standard released)

 
     
 

 

  MEMSCAP MUMPs
  MUMPs-PLUS!

The MUMPs-PLUS! service offers a low-cost pathway to semi-custom MEMS processing. MUMPs-PLUS! allows customers to specify thickness, material, or sequence changes and additions to the standard MUMPs processes and runs offered as part of the run schedule. MEMSCAP modifies the lot size to allow for a "mini-lot" that will be used to support the MUMPs-PLUS! customized flow. The customer pays the standard die price plus any costs associated with non-batched or non-standard steps.

For example, customer A has a device that requires the PolyMUMPs process PLUS a thicker Oxide1 layer and a patterned/etched backside. MEMSCAP will add extra wafers to the standard lot and run this "mini-lot" along with the standard lot for all of the processing common to both the standard and MUMPs-PLUS! custom flow. For the thicker Oxide1 and backside pattern/etch, MEMSCAP separates the wafers from the "mini-lot" from those in the standard lot to perform the custom processing. At the end of fabrication, MEMSCAP singulates and ships the customer die from the wafers in the "mini-lot". The MUMPs-PLUS! customer enjoys tremendous savings because there are no mask or processing costs for the standard steps, beyond the standard die site rate. The customer only pays for the non-batch and custom steps, plus any additional masks and engineering.

MUMPs-PLUS! may be ordered on any regularly scheduled run. To find out if your process sequence fits into the MUMPs-PLUS! framework, please contact the EUROPRACTICE MEMS MPW Service first. We will discuss your requirements with MEMSCAP or bring you in contact with MEMSCAP directly. Customers eligible for the EU-Discounted Price will get a similar discount for the common processing steps with standard lot (not on the non-batch and custom steps).

   MUMPs-PLUS!

Standard Price

EU-Discounted Price

Please ask for a quotation

 
     
 

 

  Teledyne Dalsa
  MIDIS

MIDIS

Standard Price

EU-Discounted Price

4mm x 4mm

8000 Canadian dollar

NA

4mm x 8mm

15400 Canadian dollar

NA

8mm x 8mm

29800 Canadian dollar

NA

     
     

 

 

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