Technologies >MEMS > Teledyne Dalsa
Teledyne Dalsa MIDIS technology

The Teledyne Dalsa MIDIS (MEMS Integrated Design for Inertial Sensors) platform is designed to provide a standard process for manufacturing accelerometers and gyroscopes and integrating them into an Inertial Measurement Unit (IMU) for application areas such as consumer (mobile), automotive, aerospace and sports/health markets.

Academic Europractice customers can access the MIDIS Multi-Project-Wafer (MPW) service through CMC Microsystems.

 

Features of MIDIS
  • Getter-free, high-vacuum sealing allows resonator Q factors larger than 20000
  • Efficient wafer level packaging minimizes overall die size
  • 1.5um feature size in a 30um thick membrane
  • Comb height control allows out-of-plane sensing
  • TSV allows compact design ready for co-packaging

 

MIDIS cross section
MIDIS process cross section

 

Applications
  • Accelerometers
  • Gyroscopes
  • Resonators

 

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