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Silicon Photonics Packaging design rules

Packaging Introduction:

Europractice-IC provides access to photonic packaging. Users ordering photonic dies can also access packaged photonic chips. The packaging is enabled through standardized design rules for electrical and optical ports. It is important that the users use the packaging design rules for designing the photonic chips. The packaging service is enabled by Tyndall National Institute, Ireland.

Ordering Instructions:

To order packaging fill out the packaging order form and send it by email to epsiphot@imec.be. After the packaging request form is received by us, we will send users a confirmation document. This confirmation document is to be signed, scanned and emailed back to us. This confirms the order for packaging. Order for packaging must follow the order for photonic dies within one month.

Shipment and Invoicing:

It is estimated that six weeks after fabrication is complete the packaged dies will be shipped to the customers with the invoice.

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