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Foundry access - general information

Getting access to the EUROPRACTICE IC Service is very easy. The agreements we have with our foundry and library partners guarantees access to foundry information, design kits, prototyping and small and medium volume production.

By signing the appropriate NDA (Non-Disclosure Agreement) or DKLA (Design Kit License Agreement) for the technologies you want to get access to, Europractice will send you the foundry rules, cell libraries and design kits.

How to apply?

We distinguish 2 kind of customers :

European universities and research institutes Europractice members

These are universities and research institutes from European countries and that have paid an annual Europractice FULL-IC membership fee of 1100 €

Registration and payment for Europractice FULL-IC membership has to be done through our partner STFC in UK (responsible for CAD tools for academia).

Those customers that have paid their FULL IC membership fee get a membership ID and can get also purchase CAD tools through Europractice via STFC. Only those that have paid their FULL IC membership fee will be able to benefit from discounted prototyping prices.

In order for these category of customers to access foundry, just sign the appropriate NDA or DKLA and send them to

IMEC
Attn : Paul Malisse
Kapeldreef 75
B-3001 Leuven, Belgium
Email :
mpc@imec.be

A few days later you will get the necessary documents, cell libraries and design kits to start the ASIC design.

Others

These are :

In principle there is no restriction from which country the customer is, except that access is not prohibited by European and/or international export regulations.

In order for these category of customers to access foundry, just follow the guidelines for each of the foundries and sign the appropriate NDA or DKLA and send them to

IMEC
Attn : Paul Malisse
Kapeldreef 75
B-3001 Leuven, Belgium
Email :
mpc@imec.be

A few days later you will get a customer ID and the necessary documents, cell libraries and design kits to start the ASIC design.

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