Teledyne Dalsa

Technologies

Teledyne

MIDIS TM (MEMS Integrated Design for Inertial Sensors)

Technology characteristicsMEMS Integrated Design for Inertial Sensors (MIDIS TM).
1cm Die size: From 16mm² to 64mm²
The MIDIS TM Platform is being offered as Multi-Project-Wafer (MPW) service through CMC Microsystems.
Special featuresGetter-free high-vacuum sealing allows resonator Q factors > 20,000.
Efficient wafer-level packaging minimizes overall die size.
1.5 µm feature size in a 30 µm thick membrane.
Comb height control allows out-of-plane sensing.
TSV allows compact design ready for co-packaging.
Application areaAccelerometers Gyroscopes Resonators Inertial sensor combos (Sensor fusion)
Design Kit VersionConventor Catapult (Designer) from CoventorWAreTM Cadence IC 6.1.5 ANSYS
Frontend Backend ToolsMK15S1 V1P3
Turnaround timeTypical leadtime: 15 weeks from MPW run deadline to packaged parts

This website uses cookies for analytics purposes only without any commercial intent. Find out more here

The cookie settings on this website are set to "allow cookies" to give you the best browsing experience possible. If you continue to use this website without changing your cookie settings or you click "Accept" below then you are consenting to this.

Close