EUROPRACTICE offers access to the 200mm Si-Photonics technology: CMOS Si310-PHMP2M
This MPW capability on 310nm SOI platform is offering the design of various best performance passive and high-speed active devices such as silicon electro-optic modulators and germanium photo-detectors and still coupled with thermal tuning capability as metal heaters. Two AlCu levels are available for more optimal routing which is also compatible for backend treatment as Under Bump Metallization.
200mm SOI platform with 300nm Si and 800nm buried oxide Multilevel patterning to define various silicon heights of 0, 65, 165 and 300nm 2 metal layers Passive structures - 1D & 2D Grating couplers - Shallow, deep rib and strip waveguides & bends Active structures - Lateral Ge PIN photodiode - MZ and RR Modulators - Multimode interferometers - TiTiN Metal heater
Telecom, DataCom, ComputerCom.
Design kits version
DK font-end/back-end tools
Cadence IC 6.1.5, Phoenix Software, Mentor Graphics Pyxis 15.5.5
DK simulation tools
Price & Fabrication schedule
Check mycmp.fr for new prices
All packages provided by CMP
Typical Turnaround time
Typical leadtime: 32 weeks
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