The ISiPP50G platform co-integrates a wide variety of passive and active components to support a wide range of optical transceiver architectures at data rates of 25Gb/s or 50Gb/s. The offered integrated components include low-loss waveguides, efficient vertical grating or broadband edge couplers, high-speed silicon electro-optic modulators, high-speed silicon-germanium electro-absorption modulators and high-speed germanium waveguide photo-detectors. iSiPP50G offers state-of-the-art performance, design flexibility and superior CD and thickness control. It is a fixed process technology (130nm) with a validated device library.
|3 silicon patterning steps||3 etch depths in||3 silicon patterning steps|
|220nm Si: 70nm,||220nm Si: 70nm,||220nm Si: 70nm,|
|160nm; 220nm||160nm; 220nm||160nm; 220nm|
|(193 nm litho)||Strip/rib waveguides,||(193 nm litho)|
|various passive||various passive||various passive|
|optical devices,||optical devices,||optical devices,|
|silicon taper||silicon taper||silicon taper|
|Gate oxide and||Gate oxide and||Gate oxide and|
|Poly-Silicon layer||1 etch depth:||Poly-Silicon layer|
imec Si-Photonics Passives+ technology is a subset of iSiPP50G technology.
BioPIX is imec’s silicon nitride (SiN) photonics platform which is particularly optimized for applications in the visible and near infra-red wavelengths. It is based on PECVD silicon nitride, which allows highly repeatable and low variability fabrication of integrated photonic devices on 180nm process technology. It is available in two different technology flavors:
The platform offers possibility of two depth levels for SiN etch to allow fabrication of components such as strip waveguide, rib waveguide, shallow and fully etched grating couplers etc. The platform also allows selective removal of cladding from waveguides for micro-fluidic channels and sensing zones etc. Designing for this platform is supported through the process-design-kits (PDK) for Synopsys and Luceda Photonics software.
BioPIX platform for MPW services is currently available only through EU project PIX4life.
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