Standard packaging

Price structure

  • The prices below are valid for all packages and bonding of designs with pad pitch of min. 90 microns
  • Minimum price for all packages depends on the EUROPRACTICE partner you work with.
     Fraunhofer and imec: the price of 10 packages.
     CMP: the price of 5 packages.
  • Cost for wire bonding length < 6mm and a passivation opening > 60µm x 60µm
  • Cost for glass lids for 1 to 20 packages: €150
    For more than 20 packages: €7,50 per package

Please make sure you follow ASIC Package Design Rules

Ceramic Packages

For Fraunhofer and imec customers, all CPGA and CERQUAD FP packages require a setup cost of €200 per bonding diagram. A setup cost is not involved for DIL, CSOIC, CLCC and JLCC.

For CMP customers, a preparation fee is €100 per bonding diagram and there is no fee required for EUROPRACTICE members.

Standard Ceramic Packaging Price List 2019

TypeEUR
Dual-in-lineDIL 1643
DIL 1858
DIL 2453
DIL 2854
DIL 4058
DIL 4867
Ceramic Small Outline Integrated CircuitCSOIC 1673
CSOIC 2083
CSOIC 2486
CSOIC 2890
C-Leadless Chip CarriersCLCC 4458
CLCC 6879
CLCC 8480
J-Leaded Chip CarriersJLCC 4476
JLCC 6887
JLCC 8499
Ceramic Pin Grid ArrayCPGA 8485
CPGA 10097
CPGA 120108
CPGA 144116
CPGA 208185
CPGA 256239
Ceramic Quad Flat PackageCERQUAD FP 6492
CERQUAD FP 120123
CERQUAD FP 160141

Plastic 'Open-Pak' packages

The silicon thickness for “Open-Pak” plastic types may not exceed 280µm (11 mils). Please check it with the partner responsible for the technology in question.
For the QFN packages, EUROPRACTICE uses default epoxy sealed lids. “Taped” lids can be provided on request and responsibility of the customer. However, we cannot guarantee that “taped” lids do not come loose during transport. EUROPRACTICE takes no responsibility in this case.

 

A setup cost for plastic Open-Pak SOIC and QFN is €300.

Plastic “Open-Pak” packages Price List 2019

TypeEUR
Small Outline ICSOIC 8 *70
SOIC 16 64
SOIC 20 69
SOIC 24 72
SOIC 28 77
Quad-Flat No-leadsQFN 16 (5×5) 50
QFN 24 (5×5) 62
QFN 32 (5×5) 73
QFN 40 (6×6) 76
QFN 48 (7×7) 80
QFN 56 (8×8) 86
QFN 64 (9×9) 98
QFN 80 (12×12) 107
QFN 88 (10×10) 118
QFN 100 (12×12) 131

* available for CMP customers

 

Plastic packages for small quantities (<100 units)

  • applicable to standard plastic packages available as open-tool on the market
  • assembly cost on request
  • extra delivery time

Photonics Packaging

These services are provided by the EUROPRACTICE partner Tyndall. For full detail please download the document.

Fibre Only CouplingFibre-only Coupling (FOC) packaging is suited to simple Si-PICs that do not have any integrated electrical components, such as those from the IMEC “passives-only” MPW run. Alternatively, FOC assemblies allow users to perform flexible electrical probe-tests on a stable optical platform. If users does not plan on actively cooling the FOC assemblies, we strongly recommend directly bonding them to a high-capacity heat-sink.
Two Single Fibres (FOC-2S)The two-single-fibre FOC option is the simplest packaged assembly, and is available with either SM- or PM fibres. For both SMF and PMF options, the fibres are terminated in FC-APC connectors. The single-fibres are simultaneously actively aligned to the grating-couplers on the Si-PIC, by maximising the fibre-to-fibre transmission between the two fibres. Consequently, a light-path with a loss of less than -20dB is needed across the PIC, or it will be impossible to package the PIC.
One-Fibre-Array (FOC-1A) The one-fibre-array FOC option allows multiple user fibre-channels to be coupled to the Si-PIC. The fibre-array is aligned to the Si-PIC using an optical-shunt between the first and last couplers on the PIC-side grating array. There are options for either 8 or 14 user-channels on the PIC (corresponding to 10 and 16 channel fibre arrays with optical-shunt alignment). Users may also choose a 250µm or 127µm pitch on the grating-array, and SMF or PMF fibres (both terminated in FC/APC connectors).
Two-Fibre-Array (FOC-2A) The two-fibre-array FOC option is essentially the symmetric application of 2x one-fibre-array FOCs. Both fibre arrays are independently aligned using separate optical-shunts. In principle, a user may specify different fibre types, user-channels, fibre-pitch for both arrays, but paired arrays are the most common configuration, and the pricing matrix here is for paired arrays. Again, SMF and PMF fibre-arrays are terminated in FC-APC connectors.
Fully packaged modules (FPMs) offer fibre- and optical- connectivity, as well as thermal stability. They are based on the Tyndall-PCB module described in Section 2.6, and offer users a low-cost “off the shelf” solution to a fully packaged device for demonstrations and prototyping. FPMs allow for up to 20 DC connections to the Si-PIC and a range of single-fibre and fibre-array QPC options. The integrated thermistor and TEC ensures thermal stability of the PIC, when connected to an external PID controller (not supplied with the module).
Two Single Fibres Option (FPM-2S) The two single-fibre fully-packaged option is available with either SM- or PM-fibres. For both SMF and PMF options, the fibres are terminated in FC-APC connectors. Note that the single-fibres are simultaneously aligned with respect to the grating-couplers on the Si-PIC by maximising the fibre-to-fibre transmission between the two fibres. Up to 10 DC wire-bond connections can be made to the two opposite sides of the Si-PIC. A 10kOhm thermistor is integrated in the Tyndall-PCB and a 3W TEC transfers heat from the PIC into the aluminium-body of the module
One Fibre-Array Option (FPM-1A) The one-fibre-array FPM option allows multiple user fibre-channels to be coupled to the Si-PIC, as well as two sets of 10 DC wire-bond connections, and thermal management. There are options for either 8 or 14 user channels on the PIC (corresponding to 10 and 16 channel fibre-arrays with optical-shunt alignment). Users may also choose between a grating-array pitch of 250µm or 127µm, and SMF or PMF fibres. Both the SMF and PMF fibre-arrays are in FC/APC connectors. Thermal management is provided by the integrated thermistor in the Tyndall-PCB and the 3W TEC, which couples heat from the PIC into the mechanical body of the module, for heat-sinking to the ambient
Two Fibre-Arrays Option (FPM-2A)The two-fibre-array FPM option allows for twice the optical connections of the FPM-1A option, as well as two sets of 10 DC wire-bond connections, and thermal management. Users can choose between a pair of fibre arrays offering 2 x 8 or 2 x 14 user-channels on the PIC (corresponding to pairs of 10 and 16 channel fibre arrays with optical-shunt alignment). Users may also choose between a grating-array pitch of 250µm or 127µm, and SMF or PMF fibres. Both the SMF and PMF fibre-arrays are in FC/APC connectors

Non-standard assembly: Price quotation on request

  • Pad pitches smaller than 90µm (see above)
  • Bondpad opening smaller than 60µm x 60µm
  • Bondwires larger than 6mm or shorter than 1.50mm
  • Bondwire angle is sharper than 45°
  • Other bondwire thickness or type
  • To many downbonds from circuit to cavity or from package pin to cavity
  • Double/triple or more bondwires to 1 package pin
  • Bondpads not inline or inside circuit
  • Special placement of die into cavity
  • Package which is not on the EUROPRACTICE list (see below)
  • Special treatments during assembly
  • Stud Bumps

 

Non-standard ceramic and plastic “Open-Pak” packages

  • Market cost of a package type
  • Minimum cost: €250 + cost of 10 packages

SOCKETS – TEST FIXTURES

 

Fixture boards for IC testing

  • Fixture boards developed by CMC for testing ICs (supporting package type 24-pin CFP up to 9 GHz, type 80-pin CFP up to ~7 GHz, type 120-pin CERQUAD FP up to 1.2 GHz)
  • Fixture design flow documentation and consulting services
  • High voltage fixtures for MEMS in DIP40, PGA68 and PGA84 packages
  • Bench-top fixtures for CFP80, CFP120, CERQUAD FP44, PGA68 and PGA84 packages

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