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Technologies

EUROPRACTICE has signed agreements with several leading foundries and library vendors to offer low cost ASIC prototyping (MPW) and small-medium volume production.

The offering includes IC technologies from the following foundries



AMIS Logo

ON Semiconductor (formerly AMIS)


The technologies offered include basic 0.7µ, 0.5µ 0.35µ and 0.18µ CMOS logic and mixed and high-voltage 0.7µ, 0.35µ and 0.18µ CMOS. The ON Semi design rules, spice parameters, design manuals and standard cell libraries and design kits are available through EUROPRACTICE after signing the DKLA. For reduced-cost single project engineering runs, MLM (Multi Level Mask) mask set is possible. ON Semi offers for all their technologies the possibility of stitching, allowing to fabricate large image sensor chips (larger than reticle field).


ams Logo

 

ams


The technologies offered include basic 0.35µ and 0.18µ CMOS logic, mixed and high-voltage 0.35µ and 0.18µ CMOS, high-speed 0.35µ SiGe BiCMOS and 0.35µ CMOS OPTO for image sensors. The ams design rules, spice parameters and design kits are available through EUROPRACTICE after signing the CA and HKLA.


IHP Logo

IHP


The technologies offered include high-speed 0.25µ and 0.13µ SiGe:C BiCMOS. The IHP design rules, spice parameters and design manuals are available through EUROPRACTICE after signing the NDA.

GF logo

 

Globalfoundries


Universities and research institutes

Universities and research institutes can only access 55nm, 40nm and 28nm CMOS based logic and mixed-signal technologies (see procedures under Foundry Access).

The GLOBALFOUNDRIES design rules, spice parameters and design kits are available through EUROPRACTICE after signing the NDA. Standard cell libraries and design kits for the GLOBALFOUNDRIES technologies are available from various IP providers.

Companies

Companies can access a wide range of GLOBAFOUNDRIES technologies ranging from 180nm down to 28nm.

Companies can get access to these technologies as well as for prototyping as for volume production

TSMC logo

 

TSMC


TSMC is offering a wide range of technologies.

Universities and research institutes

Universities and research institutes can only access 0.18u, 0.13u, 90nm, 65nm 40nm and 28nm CMOS based logic and mixed-signal/RF technologies (see procedures under Foundry Access).

The TSMC design rules, spice parameters and design kits are available through EUROPRACTICE after signing the NDA. Standard cell libraries, memories and design kits for the TSMC technologies are available from TSMC.

Companies

Companies can access a wide range of TSMC technologies ranging from 0.5u down to 28nm and upon approval to 16FF, including all flavors available such as logic, mixed-signal/RF, e-flash, SiGe, CIS (CMOS Imaging Sensor),...

Companies can get access to these technologies as well as for prototyping as for volume production

UMC Logo

 

UMC


The technologies offered include 0.18µ, 0.13µ, 0.11µ, 90nm and 65nm CMOS logic and mixed. In addition also the 0.18µ and 0.11µ CIS (CMOS Imaging Sensor) technologies are offered for image sensors. The UMC design rules, spice parameters and design kits are available through EUROPRACTICE after signing the NDA. Standard cell libraries and design kits for the UMC technologies are available from Faraday.

XFAB Logo

 

X-FAB


The technologies offered include XH018 (0.18u CMOS high voltage eflash), XT018 (0.18u CMOS SOI high voltage) and XS018 (OPTO CMOS). The X-FAB design rules, spice parameters and design manuals are available through EUROPRACTICE after signing the NDA.


 

Microsystems & MEMS Technologies :

 

MEMSCAP Logo

MEMSCAP

The Multi-User MEMS Processes, or MUMPs®, is a well-established program that has run consistently since 1992. Over 80 full process runs have been completed and shipped over that time to hundreds of organizations. MEMSCAP offers three unique stand-alone, multi-mask MEMS processes in MUMPs ® : PolyMUMPs, SOIMUMPs, MetalMUMPs and PIEZOMUMPS.

 

MEMSCAP Logo

Teledyne Dalsa

EUROPRACTICE offers in cooperation with CMC (Canada) MPW runs in Teledyne Dalsa MIDIS MEMS Technology.

 

MEMSCAP Logo

Micralyne

EUROPRACTICE offers in cooperation with CMC (Canada) MPW runs in Micralyne MicraGEM-SI MEMS Technology.

 

MEMSCAP Logo

imec SiPhotonics

imec's 220nm SOI Silicon photonics (SiPhotonics) technologies have been part of the Europractice offer since 2011. Users of these technologies target applications ranging from telecom and datacom to sensing. They get access to a PDK with design rules, design manual, and a growing library of photonic components after signing the design-kit license agreement. The basic photonic functionality of the passives-only flavor of the technology is extended by electro-optic modulators and detectors in the full-platform flavor.

 

MEMSCAP Logo

LETI SiPhotonics

Europractice users get access to LETI's 310nm SOI Silicon photonics (SiPhotonics) technologies after signing the design-kit license agreement. The PDK consists of design rules, design manuals, and a component library. On top of the basic photonic functionality of the passives-only flavor of the technology, the passives-with-heater flavor adds a metal heater for thermo-optic tuning of the circuit.

 

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