Teledyne Dalsa



MIDIS TM (MEMS Integrated Design for Inertial Sensors)

Technology characteristicsMEMS Integrated Design for Inertial Sensors (MIDIS TM).
1cm Die size: From 16mm² to 64mm²
The MIDIS TM Platform is being offered as Multi-Project-Wafer (MPW) service through CMC Microsystems.
Special featuresGetter-free high-vacuum sealing allows resonator Q factors > 20,000.
Efficient wafer-level packaging minimizes overall die size.
1.5 µm feature size in a 30 µm thick membrane.
Comb height control allows out-of-plane sensing.
TSV allows compact design ready for co-packaging.
Application areaAccelerometers Gyroscopes Resonators Inertial sensor combos (Sensor fusion)
Design Kit VersionConventor Catapult (Designer) from CoventorWAreTM Cadence IC 6.1.5 ANSYS
Frontend Backend ToolsMK15S1 V1P3
Turnaround timeTypical leadtime: 15 weeks from MPW run deadline to packaged parts

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