EUROPRACTICE is happy to announce a new MEMS process in MPW mode, namely XMB10 from X-FAB.
To stimulate users, X-FAB and imec have opened a Design Contest for novel MEMS applications in the XMB10 technology. The First Place Winner of this contest will receive a free MPW slot on the first run. You can find more information on the contest in the application form:
Single, double or triple axis inertial sensor using cavity SOI wafer based technology. Sensor elements formed by silicon DRIE process. Optional top and bottom metal layers. Top cap wafer: Silicon with etched cavities and bond pad openings. Cost effective wafer level packaging by wafer bonding.
Recessed fingers enable sensing in Z-direction. 100% efficient silicon mass possible. Refilled isolated trenches. Metal connections to the movable sensor structures. Wire crossing allowed. Small device size. Low parasitic capacitances. Low inside cavity pressure.
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