CORNERSTONE

Technologies

EUROPRACTICE offers access to the various 200mm Silicon Photonics SOI platforms offered by CORNERSTONE.

The open source, license free rapid prototyping platform offers unparalleled flexibility in its MPW runs, with the option to customize certain steps. Passive calls include 2 etch depths and optional TiN based thermal phase shifters, whilst active calls also include carrier based optical modulators. Unlike many other rapid prototyping services, CORNERSTONE utilizes DUV lithography, but also offers the unique capability to pattern certain layers using high resolution e-beam lithography.

CORNERSTONE Si-Photonics 220 nm SOI Passives

HighlightsAbility to customize certain steps
Optional use of e-beam lithography for high resolution layers
Open source PDK available
No license required
Rapid turn-around
Option for design consultancy
Technology Characteristics2 Si etch depths: 70 nm & 220 nm
TiN based thermal phase shifters
Option for no cladding if no heaters are required
Design ToolsLuceda Photonics’ IPKISS platform
Foundry IP

Standard Components Library_SOI

GDSII Template 20200628

ApplicationDatacoms, telecoms, LIDAR

CORNERSTONE Si-Photonics 220 nm SOI Actives

HighlightsAbility to customize certain steps
Optional use of e-beam lithography for high resolution layers
Open source PDK available
No license required
Option for design consultancy
Technology CharacteristicsHigh resistivity handle wafer (750 ohm.cm)
3 Si etch depths: 70 nm, 120 nm & 220 nm
4 implantation levels for carrier based modulators
1 metal layer for ohmic contacts
Design ToolsLuceda Photonics’ IPKISS platform
Foundry IP

Standard Components Library_SOI

GDSII Template 20200628

ApplicationDatacoms, telecoms, LIDAR

CORNERSTONE Si-Photonics 340 nm SOI Passives

HighlightsLower loss platform
Ability to customize certain steps
Optional use of e-beam lithography for high resolution layers
Open source PDK available
No license required
Rapid turn-around
Option for design consultancy
Technology Characteristics2 Si etch depths: 140 nm & 340 nm
TiN based thermal phase shifters
Option for no cladding if no heaters are required
Design ToolsLuceda Photonics’ IPKISS platform
Foundry IP

Standard Components Library_SOI

GDSII Template 20200628

ApplicationDatacoms, telecoms, quantum photonics, LIDAR

CORNERSTONE Si-Photonics 500 nm SOI Passives

HighlightsAbility to support mid-IR wavelengths
Low loss platform
Ability to customize certain steps
Optional use of e-beam lithography for high resolution layers
Open source PDK available
No license required
Rapid turn-around
Option for design consultancy
Technology Characteristics2 Si etch depths: 160 nm & 300 nm
TiN based thermal phase shifters
Option for no cladding if no heaters are required
Design ToolsLuceda Photonics’ IPKISS platform
Foundry IP

Standard Components Library_SOI

GDSII Template 20200628

ApplicationMid-IR applications including sensing, datacoms, telecoms, quantum photonics

Design documentation is available on the CORNERSTONE website.

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