Schedules 2021

MPW Schedules 2021

On this page, you can find General and mini@sic MPW schedules for 2021.

Our latest pricelists for 2021 are available here. And here you can register online for MPW runs in 2021

If you have any questions, please do not hesitate to let us know.

ams

  ams MPW  Jan    Feb    Mar    Apr    May    Jun    Jul    Aug    Sep    Oct    Nov    Dec  
  ams 0.35µ CMOS C35B4C3 4M/2P/HR/5V IO222825
  ams 0.35µ CMOS C35OPTO 4M/2P/5V IO222825
  ams 0.35µ HV CMOS H35B4D3 120V 4M38
  ams 0.35µ SiGe-BiCMOS S35D4M5 /
  CMOS-RF C35B4M3 4M/4P Thick MET4 - MIM
227

Important notes: Dates are GDS submission deadlines. Design registration must be done at least 2 weeks in advance.

EM Microelectronic

  EM Microelectronic MPW  Jan    Feb    Mar    Apr    May    Jun    Jul    Aug    Sep    Oct    Nov    Dec  
  IC 0.18µm CMOS EMALP18 logic214

GLOBALFOUNDRIES

  GLOBALFOUNDRIES MPW  Jan    Feb    Mar    Apr    May    Jun    Jul    Aug    Sep    Oct    Nov    Dec  
  GLOBALFOUNDRIES SiGe 8XP15251615
  GLOBALFOUNDRIES 130nm BCDlite81221946
  GLOBALFOUNDRIES 130nm LP81221946
  GLOBALFOUNDRIES 55 nm LPe-RF/LPx-NVM25292512138
  GLOBALFOUNDRIES 45RFSOI7106
  GLOBALFOUNDRIES 40 nm LP/LP-RF/RF-mmWave11466
  GLOBALFOUNDRIES 28 nm SLP/SLP-RF151091
  GLOBALFOUNDRIES 22 nm FDSOI182217192015
  GLOBALFOUNDRIES 12 nm LP+11121211

Important notes: Dates are Registration deadlines after which designs cannot be accepted.

Final GDSII file must be submitted within 6 weeks after this date.

A cancellation fee is applicable if the registration is cancelled later than 2 weeks after the Registration deadline or if the customer is unable to provide a DRC-clean GDS before the Tapeout deadline.
Dates in red are preliminary.

  GLOBALFOUNDRIES mini@sic  Jan    Feb    Mar    Apr    May    Jun    Jul    Aug    Sep    Oct    Nov    Dec  
  GLOBALFOUNDRIES 130nm BCDlite124
  GLOBALFOUNDRIES 45RFSOI106
  GLOBALFOUNDRIES 22 nm FDSOI221915

Important notes: Dates are Registration deadlines after which designs cannot be accepted.

Final GDSII file must be submitted within 6 weeks after this date.

A cancellation fee is applicable if the registration is cancelled later than 2 weeks after the Registration deadline or if the customer is unable to provide a DRC-clean GDS before the Tapeout deadline.

We reserve the right to cancel mini@sic runs if the run is not economically feasible.
mini@sic participation is possible only with mandatory metal stack and inline wirebond.
Dates in red are preliminary.

IHP

  IHP MPW  Jan    Feb    Mar    Apr    May    Jun    Jul    Aug    Sep    Oct    Nov    Dec  
  IHP SGB25V 0.25µ SiGe:C Bipolar/Analog, Ft/Fmax= 75/95GHz, 5M/MIM, breakdown voltages up to 7V52322***
  IHP SG25H3 0.25µ SiGe:C Bipolar/Analog, Ft/Fmax= 110/180GHz, 5M/MIM, breakdown voltages up to 7V52322**
  SG25H5_EPIC Bipolar/Analog, Ft/Fmax= 250/300GHz, 7M/MIM + Photonics1622
  IHP SG25 PIC (Photonics, Ge Photo-diode, BEOL)2230
  IHP SG13S SiGe:C Bipolar/Analog, Ft/Fmax= 250/300GHz, 7M/MIM + optional TSV1126*251026
  IHP SG13C SiGe:C CMOS 7M/MIM1126251026
  IHP SG13G2 SiGe:C Bipolar/Analog, Ft/Fmax= 300/500GHz, 7M/MIM + optional TSV1126*251026
  IHP SG13G2Cu FEOL process SG13G2 together with Cu BEOL option112625*1026
  IHP SG13SCu FEOL process SG13S together with Cu BEOL option112625*1026
  IHP BEOL SG13 (M1 and Metal Layers Above) + optional LBE or TSV26

Important notes: Dates are Registration deadlines. Final GDSII file must be submitted within 10 days after this date

* Additional MPW runs offered only when the cumulative area > 10 mm²

** Additional MPW runs offered only when the cumulative area > 18 mm²

*** Additional MPW runs offered only when the cumulative area > 25 mm²

Dates in red: For the runs on 11 January, Registration deadline is 14 December 2020. Final GDSII file must be submitted within 21 days after this date.

 

TSV available for IHP SG13S and SG13G2 technologies with extra charge

Cu Pillar and Bumping available for all IHP technologies with extra charge

Local Backside Etching (LBE) is not offered for EPIC runs and runs with Cu-BEOL

  IHP mini@sic  Jan    Feb    Mar    Apr    May    Jun    Jul    Aug    Sep    Oct    Nov    Dec  
  IHP SGB25V 0.25µ SiGe:C Bipolar/Analog, Ft/Fmax= 75/95GHz, 5M/MIM, breakdown voltages up to 7V52322***
  IHP SG25H3 0.25µ SiGe:C Bipolar/Analog, Ft/Fmax= 110/180GHz, 5M/MIM, breakdown voltages up to 7V52322**
  SG25H5_EPIC Bipolar/Analog, Ft/Fmax= 250/300GHz, 7M/MIM + Photonics1622
  IHP SG25 PIC (Photonics, Ge Photo-diode, BEOL)2230
  IHP SG13S SiGe:C Bipolar/Analog, Ft/Fmax= 250/300GHz, 7M/MIM + optional TSV1126*251026
  IHP SG13C SiGe:C CMOS 7M/MIM1126251026
  IHP SG13G2 SiGe:C Bipolar/Analog, Ft/Fmax= 300/500GHz, 7M/MIM + optional TSV1126*251026
  IHP SG13G2Cu FEOL process SG13G2 together with Cu BEOL option112625*1026
  IHP SG13SCu FEOL process SG13S together with Cu BEOL option112625*1026
  IHP BEOL SG13 (M1 and Metal Layers Above) + optional LBE or TSV26

Important notes: Dates are Registration deadlines. Final GDSII file must be submitted within 10 days after this date

* Additional MPW runs offered only when the cumulative area > 10 mm²

** Additional MPW runs offered only when the cumulative area > 18 mm²

*** Additional MPW runs offered only when the cumulative area > 25 mm²

Dates in red: For the runs on 11 January, Registration deadline is 14 December 2020. Final GDSII file must be submitted within 21 days after this date.

 

TSV available for IHP SG13S and SG13G2 technologies with extra charge

Cu Pillar and Bumping available for all IHP technologies with extra charge

Local Backside Etching (LBE) is not offered for EPIC runs and runs with Cu-BEOL

ON Semiconductor

  ON Semiconductor MPW  Jan    Feb    Mar    Apr    May    Jun    Jul    Aug    Sep    Oct    Nov    Dec  
ON Semi 0.7µ C07M-D 2M/1P & ON Semi 0.7µ C07M-A 2M/1P/PdiffC/HR4221925
ON Semi 0.7µ C07M-I2T100 100 V - 2M & 3M options4221925
ON Semi 0.5µ CMOS EEPROM C5F & C5N – 200 mm222622
ON Semi 0.35µ C035U - 4M (3M & 5M optional) only thick top metal25121131
ON Semi 0.35µ C035 - I3T25U 3.3/25 V 4M (3M & 5M optional) only thick top metal25121131
ON Semi 0.35µ C035 - I3T80U 80 V 4M - 3M optional (5M on special request)4154
ON Semi 0.35µ C035 - I3T50U (E) 50 V 4M - 3M optional (5M on special request)12511
ONC18MS (0.18 µm - 1.8/3.3 V - 15V DMOS - 5LM - MiMC - ESD - HiR - EPI)1679116
ONC18MS-LL (=ONC18MS + High Vt)1679116
ONC18HPA (= ONC18MS + DNW + Zener + Stacked MiMC + Native Dev + Schottky)1679116
ONC18-I4T 45/70V HV CMOS (=ONC18MS + 30V + 45V + 70V DMOS)1679116

Important notes: Dates are GDS submission deadlines. Design registration has to be done at least 3 weeks in advance.

Dates in red are preliminary.

  ON Semiconductor mini@sicJanFebMarAprMayJunJulAugSepOctNovDec
ON Semi 0.7µ C07M-D 2M/1P & ON Semi 0.7µ C07M-A 2M/1P/PdiffC/HR4221925
ON Semi 0.7µ C07M-I2T100 100 V - 2M & 3M options4221925
ON Semi 0.35µ C035U - 4M (3M & 5M optional) only thick top metal25121131
ON Semi 0.35µ C035 - I3T25U 3.3/25 V 4M (3M & 5M optional) only thick top metal25121131
ON Semi 0.35µ C035 - I3T80U 80 V 4M - 3M optional (5M on special request)4154
ON Semi 0.35µ C035 - I3T50U (E) 50 V 4M - 3M optional (5M on special request)12511

Important notes: Dates are GDS submission deadlines. Design registration has to be done at least 3 weeks in advance.

Dates in red are preliminary.

STMicroelectronics

  STMicroelectronics MPW  Jan    Feb    Mar    Apr    May    Jun    Jul    Aug    Sep    Oct    Nov    Dec  
  ST 28nm CMOS28FDSOI2920
  ST 55nm BiCMOS055142
  ST 65nm CMOS065242
  ST 130nm BiCMOS9MW12429
  0.16µm BCD8sP1417
  0.16µm BCD8s-SOI30

Important notes: Dates are GDS submission deadlines. Design registration has to be done at least 4 weeks in advance.

TSMC

  TSMC MPW  Jan    Feb    Mar    Apr    May    Jun    Jul    Aug    Sep    Oct    Nov    Dec  
TSMC 0.18µm CMOS Logic or Mixed-Signal/RF, General Purpose61710,247,2112,193041,29272423
TSMC 0.18µm CMOS High Voltage BCD Gen 261710,2421123041,29272423
TSMC 0.13µm CMOS Logic or MS/RF, GP or LP (8-inch)3546
TSMC 0.13µm CMOS Logic or MS/RF, GP or LP (12-inch)3797131
TSMC 90nm CMOS Logic or MS/RF, GP or LP776
TSMC 65nm CMOS Logic or MS/RF, GP or LP33212630281,29271
TSMC 40nm CMOS Logic or MS/RF, GP or LP (no triple gate oxide)103,31282,3041631
TSMC 28nm CMOS Logic or RF HPC/HPC+33,24282,30282529272416
TSMC 16nm CMOS Logic or RF FinFET Compact10311928291

Important notes: Dates are GDS submission deadlines. Design registration must be done at least 3 months in advance.

Bumping is available upon request for all 12-inch technologies.

Contact eptsmc@imec.be if any of the following options are used: Bumping, MTP/OTP, Deep Trench, High Linearity MiM, Schottky Barrier Diode, ULL N/PMOS.

Dates in red are preliminary.

  TSMC mini@sic  Jan    Feb    Mar    Apr    May    Jun    Jul    Aug    Sep    Oct    Nov    Dec  
TSMC 0.18µm CMOS General Mixed-Signal/RF10122517
TSMC 0.18µm CMOS High Voltage BCD Gen 21420
TSMC 65nm CMOS Low Power MS/RF2714212224
TSMC 40nm CMOS Low Power MS/RF2427
TSMC 28nm CMOS RF HPC+172317
TSMC 28nm CMOS RF HPC26

Important notes: Dates are GDS submission deadlines. Design registration must be done at least 3 months in advance.

Additional technology options are available for TSMC mini@sic.

Bumping is available upon request for all 12-inch technologies.

Contact eptsmc@imec.be if any of the following options are used: Bumping, MTP/OTP, Deep Trench, High Linearity MiM, Schottky Barrier Diode, ULL N/PMOS.
Dates in red are preliminary.

UMC

  UMC MPW  Jan    Feb    Mar    Apr    May    Jun    Jul    Aug    Sep    Oct    Nov    Dec  
  UMC 28N Logic/Mixed-Mode - HPC1725
  UMC 40N Logic/Mixed-Mode - LP151921329
  UMC 65N Logic/Mixed-Mode/RF - LL8312413
  UMC 65N Logic/Mixed-Mode/RF - SP8312413
  UMC L110AE Logic/Mixed-Mode/RF222628241
  UMC L130 Logic2911
  UMC L130 Mixed-Mode/RF2911
  UMC L180 Logic GII810268
  UMC L180 Mixed-Mode/RF810268
  UMC L180 EFLASH Logic GII29

Important notes: Dates are GDS submission deadlines. Design registration must be done at least 3 weeks in advance.

Additional technology options are available.

  UMC mini@sic  Jan    Feb    Mar    Apr    May    Jun    Jul    Aug    Sep    Oct    Nov    Dec  
  UMC L65N Logic/Mixed-Mode/RF - LL15276
  UMC L130 Mixed-Mode/RF224
  UMC L180 Mixed-Mode/RF13191

Important notes: Dates are GDS submission deadlines. Design registration must be done at least 3 weeks in advance.

Additional technology options are available.

X-FAB

  X-FAB MPW  Jan    Feb    Mar    Apr    May    Jun    Jul    Aug    Sep    Oct    Nov    Dec  
  XH018 0.18µ HV NVM CMOS E-FLASH11262618
  XT018 0.18µ HV SOI CMOS429141611
  XS018 0.18µ OPTO*113
  XP018 0.18µ NVM CMOS*874
  XH035 0.35µ HV CMOS113065
  XR013 0.13µ RF SOI CMOS*2326258
  XMB10 MEMS15

Important notes: Dates are GDS submission deadlines. Registration should be done at least 2 weeks in advance.

Additional technology options are available.

* In case of cancellation, there is a possibility to order these technologies by MLM.

  X-FAB mini@sic  Jan    Feb    Mar    Apr    May    Jun    Jul    Aug    Sep    Oct    Nov    Dec  
  XH018 0.18µ HV NVM CMOS E-FLASH2618
  XT018 0.18µ HV SOI CMOS2911

Important notes: Dates are GDS submission deadlines. Registration should be done at least 2 weeks in advance.

Additional technology options are available.

AMF

  AMF  Jan    Feb    Mar    Apr    May    Jun    Jul    Aug    Sep    Oct    Nov    Dec  
  Si-Photonics fabrication process AMF2225

Important notes: Dates are GDS submission deadlines. Please register on myCMP at least 2 weeks in advance.

CEA-Leti

  CEA-Leti  Jan    Feb    Mar    Apr    May    Jun    Jul    Aug    Sep    Oct    Nov    Dec  
  Photonics IC Si-220* 151
  Photonics IC Si-310** 6
  Photonics IC Si3N4-800*** 12

Important notes: Dates are GDS submission deadlines. Please register on myCMP at least 2 months in advance.

The indicated leadtime include the 2 months needed for the mask preparation and the 3 weeks dedicated to the tests.

* 300mm run with 220nm SOI and 2µm BOX including passive device and heater (1 metal layer)  ̶  availability of SiN module to be confirmed for the second run

** 300mm run with 310nm SOI and 2µm BOX including passive & active device, heater (2 metal layers)  ̶  availability of SiN module to be confirmed

*** 200mm run with 800nm high-quality LPCVD Si3N4 including passive device

CORNERSTONE

  CORNERSTONE  Jan    Feb    Mar    Apr    May    Jun    Jul    Aug    Sep    Oct    Nov    Dec  
  CORNERSTONE Si-Photonics: 220 nm SOI passives2624
  CORNERSTONE Si-Photonics: 220 nm SOI actives2624
  CORNERSTONE Si-Photonics: 340 nm SOI passives17
  CORNERSTONE Si-Photonics: 500 nm SOI passives25

Important notes: Dates are GDS submission deadlines. Registration should be done at least 4 weeks in advance.

imec

  imec  Jan    Feb    Mar    Apr    May    Jun    Jul    Aug    Sep    Oct    Nov    Dec  
  imec Si-Photonics Passives+1213
  imec Si-Photonics iSiPP50G1025
  imec SiN-Photonics BioPIX 3004
  imec GaN-IC on SOI 200V19
  imec GaN-IC on SOI 650V2020

Important notes: Dates indicate deadlines for both Registration and submission of the first version of the GDS file.

LioniX

  LioniX  Jan    Feb    Mar    Apr    May    Jun    Jul    Aug    Sep    Oct    Nov    Dec  
  LNX SiN-Photonics TriPleX VIS15TBD*
  LNX SiN-Photonics TriPleX 15503131
  LNX SiN-Photonics TriPleX 850TBD*

Important notes: Dates are GDS submission deadlines. For registration dates and other details, please contact europratice.gateway@tyndall.ie

TBD* – The exact dates in June for TriPleX VIS and in September for TriPleX 850 are to be defined.

MEMSCAP

  MEMSCAP  Jan    Feb    Mar    Apr    May    Jun    Jul    Aug    Sep    Oct    Nov    Dec  
  PolyMUMPs161719
  SOIMUMPS292
  PiezoMUMPS12424

Important notes: Dates indicate deadlines for both Registration and submission of the first version of the GDS file.

Teem Photonics

  Teem Photonics  Jan    Feb    Mar    Apr    May    Jun    Jul    Aug    Sep    Oct    Nov    Dec  
  TP Glass-photonics IC ioNext-NIR222125
  TP Glass-photonics IC ioNext-VIS222125

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