EUROPRACTICE customers can access the following TSMC technologies.
PolyMUMPs TM is the industry’s longest-running MEMS multi-project wafer service, with over a decade of history. Many universities use the service today as a way to teach beginning MEMS design at the undergraduate level, using PolyMUMPs as the “example” process.
PolyMUMPs TM is a three-layer polysilicon surface and bulk micromachining process, with 2 sacrificial layers and one metal layer. Eight mask levels create 7 physical layers. The minimum feature size in PolyMUMPs is 2µm.
PolyMUMPs | |
|---|---|
Technology characteristics | Active area (mm2): 9.8 x 9.8 Polysilicon/ gold Surface micromachining |
Special features
| Polysilicon Surface Micomachining. One poly ground layer, two structural poly layers, one gold metal layer, two oxide release layers. |
Application area
| MEMS, micromechanics, MOEMS
|
SOIMUMPs TM uses a SOI wafer with a thickness of 10µm or 25µm and allows the designer to pattern and etch both sides of the SOI wafer down to the buried oxide, enabling through-holes to pass light through. Two metal layers, one for bond pads and one for reflectivity, are included in the Standard Process. The minimum feature size in SOIMUMPs TM is 2µm.
SOIMUMPs | |
|---|---|
Technology characteristics | Active area (mm2): 9 x 9
|
Special features
| DRIE (Deep Reactive Ion Etching) on Silicon-On-Insulator wafer
|
Application area
| MEMS, micromechanics, MOEMS
|
PiezoMUMPs | |
|---|---|
Technology characteristics | Active area (mm2): 9 x 9
|
Special features
| DRIE (Deep Reactive Ion Etching) on Silicon-On-Insulator wafer + piezoelectric layer
|
Application area
| MEMS, micromechanics, MOEMS
|
