PolyMUMPs TM is the industry’s longest-running MEMS multi-project wafer service, with over a decade of history. Many universities use the service today as a way to teach beginning MEMS design at the undergraduate level, using PolyMUMPs as the “example” process.
PolyMUMPs TM is a three-layer polysilicon surface and bulk micromachining process, with 2 sacrificial layers and one metal layer. Eight mask levels create 7 physical layers. The minimum feature size in PolyMUMPs is 2µm.