18 Dec Europe secures Europractice services to European academia and industry until end 2021
LEUVEN (Belgium), December 18, 2018 —Imec, the world-leading research and innovation hub in nanoelectronics and digital technologies and its partners STFC-UKRI, Fraunhofer IIS, CMP and Tyndall announced today that Europractice was selected and granted European funding as a H2020 project. This new funding secures the Europractice services to European universities, research institutes and industry until the end of 2021. In the new H2020-project named Next Europractice eXtended Technologies and Services (NEXTS), new partners CMP and Tyndall complement and extend the Europractice offering.
Europractice has supported the European academic sector with design tools and IC prototyping for almost 30 years. The NEXTS project will integrate and build upon the well-established, widely-used and successful services offered by the project partners, extending the service to SMEs, encouraging new users from non-traditional sectors, adding new technologies to serve new markets, diversifying the service towards smart system integration and packaging, and support the training of future generations of engineers that will be required for the growing digital economy in Europe.
The NEXTS project has received funding from the European Union’s Horizon 2020 research and innovation programme under the grant agreement No 825121.
Imec is a world-leading research and innovation hub in nanoelectronics and digital technologies. The combination of our widely acclaimed leadership in microchip technology and profound software and ICT expertise is what makes us unique. By leveraging our world-class infrastructure and local and global ecosystem of partners across a multitude of industries, we create groundbreaking innovation in application domains such as healthcare, smart cities and mobility, logistics and manufacturing, energy and education.
As a trusted partner for companies, start-ups and universities we bring together more than 4,000 brilliant minds from over 97 nationalities. Imec is headquartered in Leuven, Belgium and has distributed R&D groups at a number of Flemish universities, in the Netherlands, Taiwan, USA, and offices in China, India and Japan. In 2018, imec’s revenue (P&L) totaled 583 million euro. Further information on imec can be found at www.imec-int.com.
About Fraunhofer IIS
The Fraunhofer Institute for Integrated Circuits IIS is one of the world’s leading application-oriented research institutions for microelectronic and IT system solutions and services. In the area of “Audio and Media Technologies”, the institute has been shaping the digitalization of media for more than 30 years now. In the context of “cognitive sensor technologies”, the institute researches technologies for sensor technology, data transmission technology, data analysis methods and the exploitation of data as part of data-driven services and their accompanying business models.
About STFC UKRI
The Science and Technology Facilities Council (STFC) is part of UK Research and Innovation (UKRI) an independent, non-departmental public body reporting to the Department for Business, Energy and Industrial Strategy (BEIS) and is one of Europe’s largest multi-disciplinary research organisations. STFC has over 1900 employees engaged in a wide range of scientific and technological research.
CMP is a Multi-Project Wafer (MPW) service organization in ICs, Photonic ICs and MEMS for prototyping and low volume production. Since 1981, CMP has enabled prototype fabrication and small volume production on industrial processes at very attractive costs, and has extensive technical expertise in providing MPW and related services for Universities, Research Laboratories and Industrial companies.
About Tyndall National Institute
Tyndall National Institute is a leading European research centre in integrated ICT (Information and Communications Technology) hardware and systems, specialising in both electronics and photonics – materials, devices, circuits and integrated systems. Tyndall has expertise in providing advanced photonic and electronic integration and packaging services, enabling prototype development through to pilot-scale production.