2D Experimental Pilot Line



The 2D Experimental Pilot Line (2D-EPL) has launched its second multi-project wafer (MPW) run where universities, research institutes and companies can include their designs as dies on joint wafers. The second run is mainly intended for graphene sensors, and will be offered by VTT

Why apply?
  • Customizable chips
  • Short turn around
  • Flexible process flows
  • Direct communication channels
  • Experienced partners
  • Feasibility consulting
About VTT

VTT Technical Research Centre of Finland Ltd is a state-owned non-profit research and technology organisation (RTO) with the aim of strengthening Finnish and European industrial competitiveness in multiple fields ranging from sustainable food and energy production to quantum computing. As an RTO VTT acts between universities and industry, bringing basic research towards industrial adaptation and helping the industry in their R&D needs. Graphene industrialisation at VTT is based on 2 600 m2 cleanroom in Micronova, Espoo, with a focus on wafer-scale CVD graphene process optimisation for electronics, photonics and sensors, including the integration on silicon CMOS for multiplexed sensor arrays. In addition to the MPW runs, VTT offers contract research, prototyping and small-scale manufacturing.

Important Dates
  • The call for the second run is already closed. Stay tuned for the third run that will be delivered by AMO GmbH on October 2023 (call closes on June 2023), and will be directed towards electronics but can also include sensor devices; the final definition of this MPW run will be based on expressions of interest by the potential MPW customers.
  • 1 July 2022: Call open, see specifications below
  • 30 October 2022: Call closes, design freeze
  • 1 February 2023 – 31 April 2023: MPW run
  • 1300€ set price for four dies with identical design (1×1 cm²)
  • Each die more with identical design costs 250€ in addition
  • Discount of 20% for customers from countries participating in the Horizon 2020 framework


The offered baseline process for the second MPW run is a GFET including a top/bottom contact with an optional local or global back gate, an optional encapsulation and an optional graphene-area opening. The design of the device can be adjusted within the specifications listed below.

Technology Characteristics
Material: Silicon/SiO2
Basic die size: 1 x 1 cm² (a different size can be consulted upon individual request)
General design rule: 5µm for in-layer critical dimension and over-layer alignment
Baseline Process
Gate module
Contact module
Graphene module
Encapsulation module
Raman characterisation
Electrical measurements
Bio/ Gas/ Chemical sensors, Hall Sensors, Photodetectors
The schematic shows the offered baseline process with top/bottom contact and local gate option.
EUROPRACTICE and 2D-EPL webinars on Graphene