Flexible integrated circuits (FlexICs) enable novel solutions that are simply not possible with conventional electronics. Particularly suited to applications where form factor and cost outweigh speed and performance criteria, FlexICs excel in areas such as radio frequency identification (RFID), multiplexing, driver and readout circuitry, and basic computation.
Pragmatic is revolutionising semiconductor fabrication with flexible integrated circuit (FlexIC) technology that makes it quick and easy to embed intelligence almost anywhere. Using thin-film transistor (TFT) technology in combination with conventional semiconductor processing equipment, Pragmatic FlexIC Foundry® service takes FlexICs from tape-out to delivery in around six weeks, enabling agile iterations, early end-user testing, and an accelerated time to market – at a fraction of the cost of silicon.
Pragmatic’s unique FlexIC manufacturing process eliminates many of the resource-intensive production processes of silicon manufacturing, typically using just a fraction of the power and water. It also significantly reduces the quantity of chemicals and gases consumed, making it a more sustainable option for semiconductor chips.
The second generation Helvellyn 2.1.0 technology node offers four metal layers over a 600nm minimum channel dimension n-type FET process. The process also includes a dedicated resistor layer and capacitors. With an operating voltage of 3 VDC, total thickness of 30µm, and minimum bending radius of 5mm, Helvellyn technology is ideal for applications such as IoT, wearables, AR/VR and sensing.
Together with MPW services, EUROPRACTICE users from academic institutions and research institutes can also access dedicated full-wafer runs:
Metal oxide thin-film transistor
Minimum channel dimension
L= 600 nm
Dedicated resistor layer
Independent metal routing
4 layers (2 dedicated)
Minimum bend radius
Tape-out to delivery
approx. 6 weeks
Dies in gel-box