The Photonics Packaging and System Integration Group in Tyndall National Institute have developed standardised, cost-effective, “off-the-shelf” photonic packaging solutions for photonic integrated circuits (PICs) delivered under a new service model we call “Multi-Project Packaging”.
Multi-Project Packaging (MPP) is a run-based packaging service, based on standard processes that provides a standardised photonic package module and is accessible to multiple users.
In collaboration with our packaging partner, PhotonFirst, our photonics packaging service offers EUROPRACTICE users three pre-scheduled packaging runs per year and delivers complete photonic packaged modules which help to lower the cost barriers and reduces turnaround times.
Below is a schematic representation of the service model to give an idea of the steps involved.
Allows multiple fibre-channels to be coupled to the Si-PIC by edge or grating coupling. Up to 120 DC wire-bond connections can be made to the two opposite sides of the Si-PIC. There are options for either 12 or 24 user channels on the PIC (in total, please refer to design rules for optical shunt channels). One or two fiber arrays can be attached to the user Si-PIC according to user interest. Users may also choose between a fibre array pitch of 250µm or 127µm, and SMF or PMF fibres. Both the SMF and PMF fibre-arrays use FC/APC connectors. Thermal management is provided by the integrated thermistor on the Tyndall-PCB and the 8W TEC, which couples heat from the PIC into the mechanical body of the module, for heat-sinking to the ambient. PIC dimensions of with 3 X 3 mm to 10 X 10 mm.
Please refer to the Design Rules for more details.
Grating & Edge Coupling Generic Package | |
|---|---|
Mechanical base dimensions | 104mm × 90mm × 9mm |
Compatible PIC dimensions | From 3 × 3 mm to 10 × 10 mm |
PCB dimensions | 60mm × 48mm on each side |
Electrical Packaging | Wire bonding (from either side of PIC) |
DC connections | Up to 120 DC connections
2 × 60 DC connections in each PCB split
|
Bond pad dimensions and pitch | 125µm × 1000µm, and a 250µm pitch |
Thermal solutions | Yes – Thermistors (10kOhm) and TEC (8W) |
Waveguide Pitch | 127µm or 250µm |
Optical Channel Count | 12, 24 |
Optical shunts – no. of channels | 4 for edge coupling and 2 for grating coupling |
Fiber Type | SMF & PMF |
Optical Interface | 2 × Fiber Arrays (from either side of PIC) |
This package allows for one or two optical single-fibre connections (edge coupling) and users may choose SMF or PMF fibres. Both the SMF and PMF fibres are in FC/APC connectors. Fibre attachment to the PIC is via laser welding. Thermal management is provided by the integrated thermistor on the Tyndall-generic PCB and the 8W TEC, which couples heat from the PIC into the mechanical body of the module through an aluminium heat spreader, for heat sinking to the ambient. This package has 10 DC electrical connections.
Please refer to the Design Rules for more details.
Single Lensed Fiber Generic Package | |
|---|---|
Mechanical base dimensions | 74mm × 51.5mm × 8mm |
Compatible PIC dimensions | Up to 5 × 5 mm |
PCB dimensions | 25mm × 20mm × 1.6mm |
DC connections | 10
|
Thermal solutions | Yes – Thermistors (10kOhm) and TEC (8W) |
Waveguide Pitch | NA |
Optical Channel Count | 1 |
Fiber Type | SMF & PMF |
Optical Interface | 2 × Single Fibers (from either side of PIC) |
For full technology details, please explore our Photonics Packaging Design Rules:
To find out more about our packaging services, please complete the Initial Enquiry Form and send it to marc.rensing@tyndall.ie to express your interest and for further discussions.
To commit to a packaging run, please complete the MPP Run Registration Form and return to the same contact above.
