Here you can find General MPW and mini@sic run schedules and pricelists for 2023.
To reserve your seat on a run, please register your design in the Registration Form or contact the EUROPRACTICE partner responsible for the technology.
There are two prices in the EUROPRACTICE lists: Discounted and Standard.
Three conditions should be met for Discounted prices:
Standard prices apply to all other customers.
We are currently working on the Schedules and Prices 2023. We will post more information here as soon as it is available to us.
ams MPW | Jan | Feb | Mar | Apr | May | Jun | Jul | Aug | Sep | Oct | Nov | Dec | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
ams 0.35µ CMOS C35B4C3 4M/2P/HR/5V IO | 27 | 17 | 6 | ||||||||||
ams 0.35µ CMOS C35OPTO 4M/2P/5V | 27 | 17 | 6 | ||||||||||
ams 0.35µ HV CMOS H35B4D3 120V 4M | 8 | 27 | |||||||||||
ams 0.35µ SiGe-BiCMOS S35D4M5 / CMOS-RF C35B4M3 4M/4P Thick MET4 – MIM | 9 | ||||||||||||
ams 0.18µ CMOS atC18C6SH 6M/1P/HR/MIM/TW (Triple-well), 1.8V/3.3V | 20 |
Important notes: Dates are GDS submission deadlines. Design registration must be done at least 2 weeks in advance.
Dates in red are MPW runs on request.
ams MPW Pricelist | Standard EUR / mm² | Discounted EUR / mm² | |
---|---|---|---|
ams 0.35µ CMOS C35B4C3 4M/2P/HR/5V IO | 640 1 | 580 1 | |
ams 0.35µ CMOS C35OPTO 4M/2P/5V | 800 2 | 700 2 | |
ams 0.35µ HV CMOS H35B4D3 120V 4M | 880 1 | 800 1 | |
ams 0.35µ SiGe-BiCMOS S35D4M5 /CMOS-RF C35B4M3 4M/4P Thick MET4 – MIM | 880 1 | 800 1 | |
ams 0.18µ CMOS atC18C6SH 6M/1P/HRP/TW (Triple-well), 1.8V/3.3V | 1,650 3 | 1,500 3 |
Important notes:
1 Price = area (mm2) * price/mm2 with min. fabrication cost equivalent to 10mm2
2 Price = area (mm2) * price/mm2 with min. fabrication cost equivalent to 20mm2
3 Price = area (mm2) * price/mm2 with min. fabrication cost equivalent to 15mm2
Fraunhofer IISB | Jan | Feb | Mar | Apr | May | Jun | Jul | Aug | Sep | Oct | Nov | Dec | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
4H-SiC CMOS HIGH TEMPERATURE | 10 | 20 |
Important notes: Dates are GDS submission deadlines. Design registration must be done at least 4 weeks in advance.
Dates in red are preliminary.
Fraunhofer IISB Pricelist | Standard EUR / mm2 | Discount EUR / mm2 | |
---|---|---|---|
4H-SiC CMOS HIGH TEMPERATURE | 825 | 750 |
Important notes: Price = area (mm2) * price/mm2 with min. fabrication cost equivalent to 5.52 mm2 (side length 2,35 mm).
IISB offers two squared standard chip sizes for MPW runs, depending on customer design dimension:
1. physical chip edge length ~2,5 mm – corresponding max. design side length is 2,35 mm
2. physical chip edge length ~5 mm – corresponding design side length is in the range of 2,36…4,85 mm
Larger chip sizes and pricing are available on request.
GLOBALFOUNDRIES MPW | Jan | Feb | Mar | Apr | May | Jun | Jul | Aug | Sep | Oct | Nov | Dec | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
GLOBALFOUNDRIES SiGe 8XP | 22 | 23 | 22 | 23 | |||||||||
GLOBALFOUNDRIES 130nm BCDlite – Gen2 | 27 | 28 | |||||||||||
GLOBALFOUNDRIES 55 nm BCDlite | 17 | 26 | 19 | ||||||||||
GLOBALFOUNDRIES 45RFSOI | 11 | 9 | 1 | ||||||||||
GLOBALFOUNDRIES 45nm SPCLO – Silicon Photonics | 15 | 13 | 12 | 12 | |||||||||
GLOBALFOUNDRIES 28 nm SLPe | 20 | 15 | 21 | 28 | |||||||||
GLOBALFOUNDRIES 22 nm FDSOI | 2 | 6 | 1 | 26 | 14 | 3 | |||||||
GLOBALFOUNDRIES 12 nm LP+ | 22 | 13 |
Important notes: Dates are Registration deadlines after which designs cannot be accepted.
Final GDSII file must be submitted within 6 weeks after this date.
Dates in red are preliminary.
A cancellation fee is applicable if the registration is cancelled later than 2 weeks after the Registration deadline or if the customer is unable to provide a DRC-clean GDS before the Tapeout deadline.
GLOBALFOUNDRIES MPW Pricelist | Standard EUR / mm² | Discounted EUR / mm² | |
---|---|---|---|
GLOBALFOUNDRIES SiGe 8XP | 5,040
| 4,800
| |
GLOBALFOUNDRIES 130 nm BCDlite | 2,280
| 2,160
| |
GLOBALFOUNDRIES 55 nm BCDlite | 5,880
| 5,640
| |
GLOBALFOUNDRIES 45RFSOI | 10,320
| 9,840
| |
GLOBALFOUNDRIES 45nm SPCLO -Silicon Photonics (price per fixed block 5mm x 5mm)
| 252,000
| 240,000
| |
GLOBALFOUNDRIES 28 nm SLPe | 12,840
| 12,240
| |
GLOBALFOUNDRIES 22 nm FDSOI | 19,680
| 18,480
| |
GLOBALFOUNDRIES 12 nm LP+ | 31,200
| 30,000
|
Important notes:
Price = area (mm2) * price/mm2 with min. fabrication cost equivalent to 9mm2. Any edge length between 1.0mm to 11mm is possible.
The mentioned die size is referred to the Pre-Shrink die size.
GLOBALFOUNDRIES mini@sic | Jan | Feb | Mar | Apr | May | Jun | Jul | Aug | Sep | Oct | Nov | Dec | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
GLOBALFOUNDRIES SiGe 8XP | 22 | 23 | 22 | 23 | |||||||||
GLOBALFOUNDRIES 130nm BCDlite – Gen2 | 27 | 28 | |||||||||||
GLOBALFOUNDRIES 55 nm BCDlite | 17 | 26 | 19 | ||||||||||
GLOBALFOUNDRIES 45RFSOI | 11 | 9 | 1 | ||||||||||
GLOBALFOUNDRIES 45nm SPCLO – Silicon Photonics | 15 | 13 | 12 | 12 | |||||||||
GLOBALFOUNDRIES 28 nm SLPe | 20 | 15 | 21 | 28 | |||||||||
GLOBALFOUNDRIES 22 nm FDSOI | 2 | 6 | 1 | 26 | 14 | 3 | |||||||
GLOBALFOUNDRIES 12 nm LP+ | 22 | 13 |
Important notes: The mini@sic model of GlobalFoundries is available only for universities and research institutes.
Dates are Registration deadlines after which designs cannot be accepted.
Final GDSII file must be submitted within 6 weeks after this date.
Dates in red are preliminary.
A cancellation fee is applicable if the registration is cancelled later than 2 weeks after the Registration deadline or if the customer is unable to provide a DRC-clean GDS before the Tapeout deadline.
GLOBALFOUNDRIES mini@sic Pricelist | Standard EUR / mm 2 | Discounted EUR / mm 2 | |
---|---|---|---|
GLOBALFOUNDRIES SiGe 8XP
| 8,064 1,4
| 7,200 1
| |
GLOBALFOUNDRIES 130nm BCDlite – Gen2
| 3,600 2,4
| 3,120 2
| |
GLOBALFOUNDRIES 55 nm BCDlite
| 8,520 1,4
| 7,920 1
| |
GLOBALFOUNDRIES 45RFSOI
| 15,000 1,4
| 13,800 1
| |
GLOBALFOUNDRIES 45nm SPCLO -Silicon Photonics
| 154,100 3,4
| 141,200 3
| |
GLOBALFOUNDRIES 28 nm SLPe
| 18,000 1,4
| 15,900 1
| |
GLOBALFOUNDRIES 22 nm FDSOI
| 27,480 1,4
| 24,120 1
| |
GLOBALFOUNDRIES 12 nm LP+
| 38,870 1,4
| 36,500 1
|
Important notes:
1 Price = area (mm²) * price/mm² with min. fabrication cost equivalent to 1 mm².
Any edge length between 1.0 mm to 11 mm is possible. The mentioned die size is referred to the Pre-Shrink die size.
2 Price = area (mm²) * price/mm² with min. fabrication cost equivalent to 2.5 mm².
Any edge length between 1.0 mm to 11 mm is possible. The mentioned die size is referred to the Pre-Shrink die size.
3 Price = fixed block size of 5mm x 2.455mm or 2.455mm x 5mm.
4 Prices applicable only for Universities and Research Institutes.
IHP MPW | Jan | Feb | Mar | Apr | May | Jun | Jul | Aug | Sep | Oct | Nov | Dec | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
IHP SGB25V 0.25µ SiGe:C Bipolar/Analog, Ft/Fmax= 75/95GHz, 5M/MIM, breakdown voltages up to 7V | 17 | 20** | |||||||||||
IHP SG25H3 0.25µ SiGe:C Bipolar/Analog, Ft/Fmax= 110/180GHz, 5M/MIM, breakdown voltages up to 7V | 17 | ||||||||||||
SG25H5_EPIC Bipolar/Analog, Ft/Fmax= 220/290GHz, 7M/MIM + Photonics | 13 | 20 | |||||||||||
IHP SG13S SiGe:C Bipolar/Analog, Ft/Fmax= 250/340GHz, 7M/MIM + optional TSV
| 16 | 1 | 24 | ||||||||||
IHP SG13C SiGe:C CMOS 7M/MIM
| 16 | 1 | 24 | ||||||||||
IHP SG13G2 SiGe:C Bipolar/Analog, Ft/Fmax= 350/450GHz, 7M/MIM + optional TSV
| 16 | 1 | 24 | ||||||||||
IHP SG13G2Cu FEOL process SG13G2 together with Cu BEOL option
| 10 | 16* | 1 | 24 | |||||||||
IHP SG13G3Cu SiGe:C Bipolar/Analog, Ft/Fmax= 500/700GHz FEOL process with Cu BEOL option
| 10 | 24 | |||||||||||
IHP SG13SCu FEOL process SG13S together with Cu BEOL option
| 10 | 16* | 1 | 24 | |||||||||
IHP SG13S + MEMRES Module + RDL
| 16 | 24 | |||||||||||
IHP SG13G2 + RDL | 16 | 24 | |||||||||||
IHP SG25 PIC (Photonics, Ge Photo-diode, BEOL)
| 28 | ||||||||||||
IHP BEOL SG13 (M1 and Metal Layers Above) + optional LBE or TSV or RDL
| 10 |
Important notes: Dates are Registration deadlines. Final GDSII file must be submitted within 10 days after this date.
* Additional MPW runs are offered only on request and when the cumulative area > 10 mm².
** Additional MPW runs are offered only on special request.
MEMRES is available for the IHP SG13S technology with extra charge.
TSV and RDL are available for IHP SG13S and SG13G2 technologies with extra charge.
Cu Pillar and Bumping are available for all IHP technologies with extra charge.
Local Backside Etching (LBE) is not offered for EPIC runs and runs with Cu-BEOL.
IHP MPW Pricelist | Standard EUR / mm² | Discounted EUR / mm² | |
---|---|---|---|
IHP SGB25V 0.25μ SiGe:C Bipolar/Analog, Ft/Fmax= 75/95GHz, 5M/MIM, breakdown voltages up to 7V | 2,800 1 | 2,380 1 | |
IHP SG25H3 0.25μ SiGe:C Bipolar/Analog, Ft/Fmax= 110/180GHz, 5M/MIM, breakdown voltages up to 7V | 4,100 1 | 3,485 1 | |
SG25H5_EPIC Bipolar/Analog, Ft/Fmax= 220/290GHz, 7M/MIM + Photonics | 8,000 1,3 | 6,800 1,3 | |
IHP SG25 PIC (Photonics, Ge Photo-diode, BEOL) + optional LBE | 3,800 1,3 | 3,230 1,3 | |
IHP SG13S SiGe:C Bipolar/Analog, Ft/Fmax= 250/300GHz, 7M/MIM + optional TSV | 6,300 1 | 5,355 1 | |
IHP SG13C SiGe:C CMOS 7M/MIM | 4,500 1 | 3,825 1 | |
IHP SG13G2 SiGe:C Bipolar/Analog, Ft/Fmax= 300/500GHz, 7M/MIM + optional TSV | 7,300 1 | 6,205 1 | |
IHP SG13G2Cu FEOL process SG13G2 together with 8 layer Cu BEOL option | 7,300 1 | 6,205 1 | |
IHP SG13G3Cu SiGe:C Bipolar/Analog, Ft/Fmax= 500/700GHz FEOL process with Cu BEOL option | 9,000 1 | 7,650 1 | |
IHP SG13SCu FEOL process SG13S together with 8 layer Cu BEOL option | 6,300 1 | 5,355 1 | |
IHP BEOL SG13 (M1 and Metal Layers Above) + optional LBE or TSV | 1,000 1 | 850 1 | |
IHP Special Services | |||
Bumping (available for all IHP technologies) | 6,500 2 | 6,500 2 | |
Localized Back side Etching (available for all IHP technologies except for EPIC/PIC runs) | 5,000 2 | 4,250 2 | |
TSV to ground (SG13S / G2) | 7,500 2 | 6,375 2 | |
Cu Pillar | 18,500 2 | on request | |
MEMRES Module one time fee for SG13S only | 2,500 2 | 2,000 2 | |
MEMRES Module additional fee per mm2 for SG13S only | 600 1 | 510 1 | |
TSV_RDL Module one time fee for SG13S and SG13G2 | 27,000 2 |
Important notes:
1 Price = area (mm2) * price/mm2 with min. fabrication cost equivalent to 0.8mm2.
The chip area is inclusive of the filler cells outside the seal ring.
2 One-off fee
3 Delivery quantity: 25 dies.
Standard MPW price is meant for designs of industrial customers.
Discounted MPW price is meant for designs created for educational purposes or publicly funded research for non-EU countries.
IHP mini@sic | Jan | Feb | Mar | Apr | May | Jun | Jul | Aug | Sep | Oct | Nov | Dec | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
IHP SGB25V 0.25µ SiGe:C Bipolar/Analog, Ft/Fmax= 75/95GHz, 5M/MIM, breakdown voltages up to 7V | 17 | 20** | |||||||||||
IHP SG25H3 0.25µ SiGe:C Bipolar/Analog, Ft/Fmax= 110/180GHz, 5M/MIM, breakdown voltages up to 7V | 17 | ||||||||||||
SG25H5_EPIC Bipolar/Analog, Ft/Fmax= 220/290GHz, 7M/MIM + Photonics | 13 | 20 | |||||||||||
IHP SG13S SiGe:C Bipolar/Analog, Ft/Fmax= 250/340GHz, 7M/MIM + optional TSV
| 16 | 1 | 24 | ||||||||||
IHP SG13C SiGe:C CMOS 7M/MIM
| 16 | 1 | 24 | ||||||||||
IHP SG13G2 SiGe:C Bipolar/Analog, Ft/Fmax= 350/450GHz, 7M/MIM + optional TSV
| 16 | 1 | 24 | ||||||||||
IHP SG13G2Cu FEOL process SG13G2 together with Cu BEOL option
| 10 | 16* | 1 | 24 | |||||||||
IHP SG13G3Cu SiGe:C Bipolar/Analog, Ft/Fmax= 500/700GHz FEOL process with Cu BEOL option
| 10 | 24 | |||||||||||
IHP SG13SCu FEOL process SG13S together with Cu BEOL option
| 10 | 16* | 1 | 24 | |||||||||
IHP SG13S + MEMRES Module + RDL
| 16 | 24 | |||||||||||
IHP SG13G2 + RDL | 16 | 24 | |||||||||||
IHP SG25 PIC (Photonics, Ge Photo-diode, BEOL)
| 28 | ||||||||||||
IHP BEOL SG13 (M1 and Metal Layers Above) + optional LBE or TSV or RDL
| 10 |
Important notes: Dates are Registration deadlines. Final GDSII file must be submitted within 10 days after this date.
* Additional MPW runs are offered only on request and when the cumulative area > 10 mm².
** Additional MPW runs are offered only on special request.
MEMRES is available for the IHP SG13S technology with extra charge.
TSV and RDL are available for IHP SG13S and SG13G2 technologies with extra charge.
Cu Pillar and Bumping are available for all IHP technologies with extra charge.
Local Backside Etching (LBE) is not offered for EPIC runs and runs with Cu-BEOL.
IHP mini@sic Pricelist | Standard EUR / mm² | Discounted EUR / mm² | |
---|---|---|---|
IHP SGB25V 0.25μ SiGe:C Bipolar/Analog, Ft/Fmax= 75/95GHz, 5M/MIM, breakdown voltages up to 7V | 2,380 1 | 2,240 1 | |
IHP SG25H3 0.25μ SiGe:C Bipolar/Analog, Ft/Fmax= 110/180GHz, 5M/MIM, breakdown voltages up to 7V | 3,485 1 | 3,280 1 | |
SG25H5_EPIC Bipolar/Analog, Ft/Fmax= 220/290GHz, 7M/MIM + Photonics | 6,800 1,3 | 6,000 1,3 | |
IHP SG25 PIC (Photonics, Ge Photo-diode, BEOL) + optional LBE | 3,230 1,3 | 2,660 1,3 | |
IHP SG13S SiGe:C Bipolar/Analog, Ft/Fmax= 250/300GHz, 7M/MIM + optional TSV | 5,355 1 | 4,410 1 | |
IHP SG13C SiGe:C CMOS 7M/MIM | 3,825 1 | 3,600 1 | |
IHP SG13G2 SiGe:C Bipolar/Analog, Ft/Fmax= 300/500GHz, 7M/MIM + optional TSV | 6,205 1 | 5,110 1 | |
IHP SG13G2Cu FEOL process SG13G2 together with 8 layer Cu BEOL option | 6,205 1 | 5,110 1 | |
IHP SG13G3Cu SiGe:C Bipolar/Analog, Ft/Fmax= 500/700GHz FEOL process with Cu BEOL option | 7,650 1 | 6,300 1 | |
IHP SG13SCu FEOL process SG13S together with 8 layer Cu BEOL option | 5,355 1 | 4,410 1 | |
IHP BEOL SG13 (M1 and Metal Layers Above) + optional LBE or TSV | 850 1 | 800 1 | |
IHP Special Services | |||
Bumping (available for all IHP technologies) | 6,500 2 | 4,700 2 | |
Localized Back side Etching (available for all IHP technologies except for EPIC/PIC runs) | 4,250 2 | 2,500 2 | |
TSV to ground (SG13S / G2) | 6,375 2 | 4,500 2 | |
Cu Pillar | on request | on request | |
MEMRES Module one time fee for SG13S only | 2,000 2 | 2,000 2 | |
MEMRES Module additional fee per mm2 for SG13S only | 510 1 | 450 1 |
Important notes:
1 Price = area (mm2) * price/mm2 with min. fabrication cost equivalent to 0.8mm2.
The chip area is inclusive of the filler cells outside the seal ring.
2 One-off fee
3 Delivery quantity: 25 dies.
Standard mini@sic price is meant for designs created for educational purposes or publicly funded research for non-EU countries.
Discounted mini@sic price is meant for designs created for educational purposes or publicly funded research for the EU countries.
TSMC MPW | Jan | Feb | Mar | Apr | May | Jun | Jul | Aug | Sep | Oct | Nov | Dec | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
TSMC 0.13µm CMOS BCD plus (12-inch) | 18 | 3 | |||||||||||
TSMC 0.13µm CMOS Logic or MS/RF, GP or LP (12-inch) | 18 | 3 | |||||||||||
TSMC 90nm CMOS Logic or MS/RF, GP or LP | 8 | 14 | |||||||||||
TSMC 65nm CMOS Logic or MS/RF, GP or LP | 1 | 1 | 5 26 | 24 | |||||||||
TSMC 40nm CMOS Logic or MS/RF, GP or LP (no triple gate oxide) | 25 | 22 | 29 | 26 | 31 | ||||||||
TSMC 28nm CMOS Logic or RF HPC/HPC+ | 1 | 1 | 3 31 | ||||||||||
TSMC 16nm CMOS Logic or RF FinFET Compact | 25 | 29 | 24 |
Important notes:
Dates are GDS submission deadlines.
Several TSMC shuttles are extremely loaded. For any technology, please make your design registration as early as possible. We will work with you and do our best to get your design on the run. If required, a waiting list will be created.
The TSMC run schedule for the second half of 2023 will be published in late March. We will share it with you as soon as it is available.
Bumping is available upon request for all 12-inch technologies.
Contact eptsmc@imec.be if any of the following options are used: Bumping, MTP/OTP, Deep Trench, High Linearity MiM, Schottky Barrier Diode, ULL N/PMOS.
Prices for all TSMC technologies can be calculated through the online Price Request Form.
When 4 or more independent sub-designs are registered in one MPW submission to optimise the minimum charged area, an additional verification charge of 1,000 USD is applicable. This is regardless of the request and charges for sub die sawing (6 USD per additional die obtained from the base MPW submission).
TSMC mini@sic | Jan | Feb | Mar | Apr | May | Jun | Jul | Aug | Sep | Oct | Nov | Dec | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
TSMC 65nm CMOS Low Power MS/RF | 25 | 29 | 17 | ||||||||||
TSMC 40nm CMOS Low Power MS/RF | 19 | ||||||||||||
TSMC 28nm CMOS RF HPC+ | 25 | 26 | |||||||||||
TSMC 16nm CMOS RF FinFET Compact | 15?* |
Important notes:
Dates are GDS submission deadlines.
Several TSMC shuttles are extremely loaded. For any technology, please make your design registration as early as possible. We will work with you and do our best to get your design on the run. If required, a waiting list will be created.
The TSMC run schedule for the second half of 2023 will be published in late March. We will share it with you as soon as it is available.
* In the second half of 2023, we will launch a first 16nm mini@sic. The date is not yet completely fixed.
For more information, please contact us at eptsmc@imec.be
Please check additional technology options for TSMC mini@sic:
TSMC mini@sic Pricelist | Standard prices | Discounted prices | |||
---|---|---|---|---|---|
EUR / min area | EUR / extra area | EUR / min area | EUR / extra area | ||
TSMC 65 LP MS RF (min area = 1 mm2) | 4,433 | 399 / 0.1 mm2 | 3,633 | 340 / 0.1 mm2 | |
TSMC 40 LP MS RF (min area = 3 mm2) * | 21,095 | 631 / 0.1 mm2 | 18,095 | 570 / 0.1 mm2 | |
TSMC 28 HPC+ RF (min area = 1 mm2) * | 10,329 | 870.78 / 0.1 mm2 | 8,229 | 788 / 0.1 mm2 | |
TSMC 16nm RF FinFET Compact | 30,022 | 2,778.36 / 0.1 mm2 | 26,022 | 2,522 / 0.1 mm2 |
Important notes:
The prices are area based, and the aspect ratio is free to choose but it is strongly recommended not to have sides less than 1mm.
Subdicing is not supported on mini@sic.
Design registration must be done at least 3 months in advance, preferably at the moment of reservation.
* The areas in the table for 28nm and 40nm are on-silicon dimensions. This means the designed area can be (area/0.81).
Please check additional technology options for TSMC mini@sic:
UMC MPW | Jan | Feb | Mar | Apr | May | Jun | Jul | Aug | Sep | Oct | Nov | Dec | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
UMC 28N Logic/Mixed-Mode – HPC | 6 | 15 | 10 | 16 | |||||||||
UMC 40N Logic/Mixed-Mode – LP | 30 | 6 | 29 | 28 | 30 | ||||||||
UMC 65N Logic/Mixed-Mode/RF – LL | 16 | 13 | 12 | 4 | 6 | ||||||||
UMC 55N Logic/Mixed-Mode/RF – SP | 16 | 13 | 1 | 12 | 4 | 6 | |||||||
UMC L110AE Logic/Mixed-Mode/RF | 23 | 3 | 22 | 31 | 2 | 27 | |||||||
UMC L180 Logic GII | 27 | 7 | 13 | ||||||||||
UMC L180 Mixed-Mode/RF | 27 | 7 | 13 |
Important notes: Dates are GDS submission deadlines. Design registration must be done at least 3 weeks in advance.
Additional technology options are available:
UMC MPW Pricelist | Standard EUR / block | Discounted EUR / block | |
---|---|---|---|
UMC L180 Logic GII, Mixed-Mode/RF | 19,000 1 | 18,060 1 | |
UMC L110AE Logic/Mixed-Mode/RF | 34,800 1 | 33,0601 | |
UMC L65nm Logic, Mixed-Mode/ RF – LL/SP | 50,600 2 | 48,080 2 | |
UMC 55N Logic/Mixed-Mode/RF – SP | 45,425 2 | 43,171 2 | |
UMC 40N Logic/Mixed-Mode – LP | 98,050 2 | 93,160 2 | |
UMC 28N Logic/ Mixed-Mode – HPC | On request. Please, contact epumc@imec.be |
Important notes:
1 Price = per block of 5mm x 5mm needed to fit the design in.
2 Price = per block of 4mm x 4mm needed to fit the design in.
UMC mini@sic | Jan | Feb | Mar | Apr | May | Jun | Jul | Aug | Sep | Oct | Nov | Dec | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
UMC 65N Logic/Mixed-Mode/RF – LL | 6 | 5 | 30 | ||||||||||
UMC L110AE Mixed-Mode/RF | 27 | 24 | 20 | ||||||||||
UMC L180 Mixed-Mode/RF | 20 | 31 | 6 |
Important notes: Dates are GDS submission deadlines. Design registration must be done at least 3 weeks in advance.
Additional technology options are available:
UMC mini@sic Pricelist | Standard EUR / block | Discounted EUR / block | |
---|---|---|---|
UMC L180 Mixed-Mode/RF – 1P6M – 1.8V/3.3V * | 4,110 1 | 3,430 1 | |
UMC L110AE Logic/Mixed-Mode/RF ** | 8,920 2 | 8,070 2 | |
UMC L65N Logic/Mixed-Mode LL *** | 12,970 3 | 11,720 3 |
Important notes:
1 Price = per block of 1525μm x 1525μm needed to fit the design in. Adding two blocks together to one block is possible.
2 Price = per block of 2425μm x 1525μm needed to fit the design in.
3 Price = per block of 1875μm x 1875μm needed to fit the design in. Adding two blocks together to one block is possible.
* UMC 0.18μm mini@sic rules
When the standard block of 5mm x 5mm is divided into 9 regular square sub-blocks, customers participating in the mini@sic program can submit one sub-block or multiple sub-blocks, depending on the size of their design:
Final price = number of sub-blocks needed to fit in the design * sub-block price.
** UMC 0.11μm mini@sic rules
*** UMC 65nm mini@sic rules
For the mini@sic program, customers can submit one sub-block or multiple sub-blocks, depending on the size of their design:
X-FAB MPW | Jan | Feb | Mar | Apr | May | Jun | Jul | Aug | Sep | Oct | Nov | Dec | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
XH018 0.18µ HV NVM CMOS E-FLASH | 27 | 10 | 23 | ||||||||||
XT018 0.18µ HV SOI CMOS | 13 | 12 | 14 | 6 | |||||||||
XS018 0.18µ OPTO * | 20 | 31 | |||||||||||
XP018 0.18µ NVM CMOS * | 6 | 29 | 2 | ||||||||||
XH035 0.35µ HV CMOS | 9 | 28 | 4 | 3 | |||||||||
XR013 0.13µ RF SOI CMOS * | 13 | 5 | 21 | 6 | |||||||||
XMB10 MEMS | 15 |
Important notes: Dates are GDS submission deadlines. Registration should be done at least 2 weeks in advance.
* In case of cancellation, there is a possibility to order these technologies by MLM.
Please take a look at additional technology options:
X-FAB MPW Pricelist | Standard EUR / mm² | Discounted EUR / mm² | |
---|---|---|---|
X-FAB XH018 0.18μ HV NVM CMOS E-FLASH (MET3, MET4, METMID, MET-THK) | 2,205 | 1,925 | |
X-FAB XT018 0.18μ HV SOI CMOS (MET3, MET4, METMID, METTHK) | 2,040 | 1,940 | |
X-FAB XS018 0.18μ OPTO (MET3, MET4, MET5, METMID) | 1,735 | 1,650 | |
X-FAB XP018 0.18μ NVM CMOS (MET3, MET4, METMID, METTHK) | 1,785 | 1,695 | |
X-FAB XH035 0.35μ HV CMOS (MET4) | 1,250 | 1,185 | |
X-FAB XR013 0.13μ RF SOI CMOS (METRB, METBQ) | 2,325 | 2,210 | |
X-FAB XR013 0.13μ RF SOI CMOS (METTHK1, METRB, METRQ) | 2,895 | 2,750 | |
XMB10 MEMS | 1,208 1 | 1,123 1 |
Important notes:
Price = area (mm2) * price/mm2 with min. fabrication cost equivalent to 10mm2.
Area will be rounded upwards to the next mm2 (for instance, 12.24mm2 will be charged as 13mm2).
Backgrinding (necessary for packaging) is not always possible and an additional cost might apply.
Delivery of 50 dies is included. Purchasing additional dies is not always possible and an additional cost may apply.
1 Delivery of 5 dies is included. Additional dies can be purchased for 10EUR/die (50 dies maximum).
X-FAB mini@sic | Jan | Feb | Mar | Apr | May | Jun | Jul | Aug | Sep | Oct | Nov | Dec | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
XH018 0.18µ HV NVM CMOS E-FLASH | 27 | 23 | |||||||||||
XT018 0.18µ HV SOI CMOS | 13 | 6 |
Important notes: Dates are GDS submission deadlines. Registration should be done at least 2 weeks in advance.
Please take a look at additional technology options:
X-FAB mini@sic Pricelist | Standard EUR / block | Discounted EUR / block | |
---|---|---|---|
X-FAB XH018 0.18μ HV NVM CMOS E-FLASH (MET3, MET4, METMID, MET-THK) | 5,130 | 4,735 | |
X-FAB XT018 0.18μ HV SOI CMOS (MET3, MET4, METMID, METTHK) | 5,175 | 4,775 |
Important notes:
Price = per block of 1520μm x 1520μm needed to fit the design in. Adding two blocks together to one block is possible.
Backgrinding (necessary for packaging) is not always possible and an additional cost might apply.
Delivery of 50 dies is included. Purchasing additional dies is not always possible and an additional cost may apply.
imec MPW | Jan | Feb | Mar | Apr | May | Jun | Jul | Aug | Sep | Oct | Nov | Dec | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
imec Si-Photonics Passives+ | 17 | ||||||||||||
imec Si-Photonics iSiPP50G | 8 | 20 | |||||||||||
imec GaN-IC on SOI 200V | 19 | ||||||||||||
GaN-IC on SOI 650V | 20 |
Important notes: Dates indicate deadlines for submission of the first version of the GDS file.
Design registration should be done at least 4 weeks in advance.
Admin. procedure should be finished at least 1 week before the dates indicated in the table.
imec MPW Pricelist Si-Photonics Passives+ 1, 2 | Standard EUR | Discounted EUR | |
---|---|---|---|
Half block – horizontal (5.15mm x 2.5mm) or vertical (2.5mm x 5.15mm) | 6,700 | 6,400 | |
1 block (5.15mm x 5.15mm) | 12,800 | 12,100 | |
2 blocks – horizontal (10.45mm x 5.15mm) or vertical (5.15mm x 10.45mm) | 22,700 | 21,500 | |
Larger sizes | Please, contact epsiphot@imec.be | ||
Extra Options | |||
Extra set of half block chips (10 samples) | +2,500 | +2,200 | |
Extra set of chips (1 block or larger; 20 samples) | +2,500 | +2,200 | |
Si-Photonics iSiPP50G 1, 2 | |||
Quarter block (2.5mm x 2.5mm) | 11,000 | 10,500 | |
Half block – horizontal (5.15mm x 2.5mm) or vertical (2.5mm x 5.15mm) | 22,000 | 21,000 | |
1 block (5.15mm x 5.15mm) | 44,000 | 42,000 | |
2 blocks – horizontal (10.45mm x 5.15mm) or vertical (5.15mm x 10.45mm) | 88,000 | 83,500 | |
4 blocks (10.45mm x 10.45mm) | 165,000 | 157,000 | |
Larger sizes | Please, contact epsiphot@imec.be | ||
Extra Options | |||
Extra set of quarter block chips (10 samples) | +2,500 | +2,200 | |
Extra set of half block chips (10 samples) | +2,500 | +2,200 | |
Extra set of chips (1 block or larger; 20 samples) | +2,500 | +2,200 |
Important notes:
1 There is a new process for the waveguides. Existing users, please be cautious.
2 Number of prototypes in standard order depends on design size: 20 for 1 block or larger, 10 for half block or smaller.
Because of typical MPW logistics, we may sometimes deliver more chips than ordered.
imec MPW Pricelist GaN-IC on SOI 200V and 650V | Standard EUR | Discounted EUR | |
---|---|---|---|
Half block (2.5mm x 5.18mm) * | 22,000 | 20,240 | |
Standard block (5.18mm x 5.18mm) | 44,000 | 40,480 | |
Double block (10.54mm x 5.18mm) | 88,000 | 80,960 | |
Extra Options | |||
Extra set of chips (40 samples) | +5,000 | +5,000 | |
Sub-dicing ** | +1,000 | +1,000 |
Important notes: Regular number of samples is 40 .
Due to the nature of MPW logistics, more chips than ordered may sometimes be shipped.
* This option is only available to academic institutions.
** Per additional dicing lane, following MPW templates only. Sub-dicing options must be approved by the technical team. Please contact ganmpw@imec-int.com in advance to evaluate your request.
MEMSCAP MPW | Jan | Feb | Mar | Apr | May | Jun | Jul | Aug | Sep | Oct | Nov | Dec | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
PolyMUMPs | 21 | ||||||||||||
SOIMUMPS | 28 | 4 | 31 | ||||||||||
PiezoMUMPS | 3 | 9 | 5 |
Important notes: Dates indicate deadlines for both Registration and submission of the first version of the GDS file.
MEMSCAP MPW Pricelist | Standard EUR / block | Discounted EUR / block | |
---|---|---|---|
PolyMUMPs (10mm x 10mm), SOIMUMPs (11 mm x 11mm), PiezoMUMPs (11mm x 11mm) | 6,500 | 5000 |