Packaging & Integration

EUROPRACTICE offers a wide range of packaging, system integration and wafer-level services. Together with standard packages, we offer customised assembly and system integration that can be done upon request.


It is important that our customers order packaging services via the same partner that was responsible for the fabrication of their prototypes. For instance, if you had your prototypes fabricated via imec, you should also access packaging services through imec.


This rule, however, does not cover our Multi-Project Fan-Out Wafer Level Packaging (MPFOWLP), which is accessible for all EUROPRACTICE customers. The Tyndall offer is also open for all the customers since this partner does not provide prototyping possibilities.





Indicate in the Design Registration form the type of package and the number of chips you would like to have assembled.

Make sure you follow ASIC Package Design Rules and download the GDS file containing available packages within EUROPRACTICE.





We recognise that novel applications and prototypes sometimes need custom solutions, as such EUROPRACTICE offers a wide range of custom solutions, ranging from simple custom wirebonds to complex multilayer optoelectronic sub-assembly.

Get in touch with us so we can figure out the best solution for your technology and applications.





For Packaging options, please contact the EUROPRACTICE partner that provides the packaging services you are interested in.


For further information on Smart System Integration, you can contact our partner Tyndall at