SCHEDULES & PRICES

2021

Schedules 2021

GENERAL MPW & MINI@SIC SCHEDULES - 2021

Here you can find General MPW and mini@sic run schedules and pricelists for 2021.

To reserve your seat on a run, please register your design in the Registration Form or contact the EUROPRACTICE partner responsible for the technology.

PRICELISTS - 2021

There are two prices in the EUROPRACTICE lists: Discounted and Standard.

DISCOUNTED PRICE

Three conditions should be met for Discounted prices:

Customer is an academic institution or a research facility from one of the 28 EU countries together with Albania, Armenia, Azerbaijan, Belarus, Bosnia-Herzegovina, Georgia, Iceland, Israel, Liechtenstein, North Macedonia, Moldova, Montenegro, Norway, Russia, Switzerland, Turkey, Serbia and Ukraine.
Customer is a registered EUROPRACTICE member who has paid the Full-IC annual membership fee.
The intended design will be done for educational purposes or for publicly funded research.

STANDARD PRICE

Standard prices apply to all other customers.

ams MPW	Feb	May	Jun	Sep	Oct	Nov
ams 0.35µ CMOS C35B4C3 4M/2P/HR/5V IO	22		28		25
ams 0.35µ CMOS C35OPTO 4M/2P/5V IO	22		28		25
ams 0.35µ HV CMOS H35B4D3 120V 4M		3				8
ams 0.35µ SiGe-BiCMOS S35D4M5 / CMOS-RF C35B4M3 4M/4P Thick MET4 – MIM	2			27

Important notes: Dates are GDS submission deadlines. Design registration must be done at least 2 weeks in advance.

ams MPW Pricelist	Standard EUR / mm²	Discounted EUR / mm²
ams 0.35µ CMOS C35B4C3 4M/2P/HR/5V IO	640¹	580¹
ams 0.35µ CMOS C35OPTO 4M/2P/5V	800²	700²
ams 0.35µ HV CMOS H35B4D3 120V 4M	880¹	800¹
ams 0.35µ SiGe-BiCMOS S35D4M5 /CMOS-RF C35B4M3 4M/4P Thick MET4 – MIM	880¹	800¹

Important notes:

¹ Price = area (mm²) * price/mm² with min. fabrication cost equivalent to 7mm²

²Price = area (mm²) * price/mm²with min. fabrication cost equivalent to 20mm²

EM Microelectronic MPW		Jan	Feb	Mar	Apr	May	Jun	Jul	Aug	Sep	Oct	Nov	Dec
IC 0.18µm CMOS EMALP18 logic			2				1				4

EM Microelectronic MPW Pricelist		Standard EUR / mm²	Discount EUR / project
0.18μm CMOS EMALPC18 logic (Area ≤ 5 mm² with min charge of 2.25 mm²)		1,950	600
0.18µm CMOS EMALPC18 logic (Area > 5mm²)		9,750+[(Area-5) x 1,250]	600

Important notes:

Area = X*Y including seal ring.

GLOBALFOUNDRIES MPW	Jan	Feb	Mar	Apr	May	Jun	Jul	Aug	Sep	Nov	Dec
GLOBALFOUNDRIES SiGe 8XP		15			25			16		22
GLOBALFOUNDRIES 130nm BCDlite		8		12		21		9			13
GLOBALFOUNDRIES 130nm LP		8		12		21		9			13
GLOBALFOUNDRIES 55 nm LPe-RF/LPx-NVM	25		29		25		12		13		13
GLOBALFOUNDRIES 45RFSOI	7				10				6
GLOBALFOUNDRIES 40 nm LP/LP-RF/RF-mmWave			1			14			6
GLOBALFOUNDRIES 28 nm SLPe		15			10			9			6
GLOBALFOUNDRIES 22 nm FDSOI	18		22		17		19		20	8*
GLOBALFOUNDRIES 12 nm LP+	11			12			12		27

Important notes:

Dates are Registration deadlines after which designs cannot be accepted.

Final GDSII file must be submitted within 6 weeks after this date.

* The tapeout deadline for this run is 6 December 2021.

A cancellation fee is applicable if the registration is cancelled later than 2 weeks after the Registration deadline or if the customer is unable to provide a DRC-clean GDS before the Tapeout deadline.

GLOBALFOUNDRIES MPW Pricelist	Standard EUR / mm²	Discounted EUR / mm²
GLOBALFOUNDRIES SiGe 8XP	4,200	4,000
GLOBALFOUNDRIES 130 nm BCDlite	1,500	1,400
GLOBALFOUNDRIES 130 nm LP	1,500	1,400
GLOBALFOUNDRIES 55 nm LPe-RF/LPx-NVM	4,000	3,800
GLOBALFOUNDRIES 45RFSOI	7,350	7,000
GLOBALFOUNDRIES 40 nm LP/LP-RF/RF-mmWave	5,000	4,700
GLOBALFOUNDRIES 28 nm SLPe	10,200	9,700
GLOBALFOUNDRIES 22 nm FDSOI	14,000	13,200
GLOBALFOUNDRIES 12 nm LP+	26,000	25,000

Important notes:

Price = area (mm²) * price/mm² with min. fabrication cost equivalent to 9mm². Any edge length between 1.0mm to 11mm is possible.

The mentioned die size is referred to the Pre-Shrink die size.

GLOBALFOUNDRIES mini@sic	Mar	Apr	May	Jul	Sep	Nov	Dec
GLOBALFOUNDRIES 130nm BCDlite		12					13
GLOBALFOUNDRIES 45RFSOI			10		6
GLOBALFOUNDRIES 22 nm FDSOI	22			19		8*

Important notes: Dates are Registration deadlines after which designs cannot be accepted.

Final GDSII file must be submitted within 6 weeks after this date.

* The tapeout deadline for this run is 6 December 2021.

We reserve the right to cancel mini@sic runs if the run is not economically feasible.
mini@sic participation is possible only with mandatory metal stack and inline wirebond.

GLOBALFOUNDRIES mini@sic Pricelist	Standard EUR / block	Discounted EUR / block
GLOBALFOUNDRIES 130 nm BCDlite	5,900¹	4,900¹
GLOBALFOUNDRIES 45RFSOI	20,900²	17,900²
GLOBALFOUNDRIES 22 nm FDSOI	29,900³	24,900³

Important notes:

¹ Price = per block of 1750µm x1750µm needed to fit the design in.

Adding two blocks together to one block is possible only with prior consultation.

² Price = per block of 1500µm x 1500µm needed to fit the design in.

Adding two blocks together to one block is possible only with prior consultation.

³ Price = per block of 1250µm x 1250µm needed to fit the design in.

Adding two blocks together to one block is possible only with prior consultation.

IHP MPW	Jan	Feb	Mar	Apr	Jun	Jul	Sep	Oct	Nov
IHP SGB25V 0.25µ SiGe:C Bipolar/Analog, Ft/Fmax= 75/95GHz, 5M/MIM, breakdown voltages up to 7V		5				23		22³
IHP SG25H3 0.25µ SiGe:C Bipolar/Analog, Ft/Fmax= 110/180GHz, 5M/MIM, breakdown voltages up to 7V		5				23		22²
SG25H5_EPIC Bipolar/Analog, Ft/Fmax= 250/300GHz, 7M/MIM + Photonics				16				22
IHP SG25 PIC (Photonics, Ge Photo-diode, BEOL)	22					30
IHP SG13S SiGe:C Bipolar/Analog, Ft/Fmax= 250/300GHz, 7M/MIM + optional TSV + optional MEMRES (only for the run on 26/11)	11		26¹		25		10		26
IHP SG13C SiGe:C CMOS 7M/MIM	11		26		25		10		26
IHP SG13G2 SiGe:C Bipolar/Analog, Ft/Fmax= 300/500GHz, 7M/MIM + optional TSV	11		26 ¹		25		10		26
IHP SG13G2Cu FEOL process SG13G2 together with Cu BEOL option	11		26		25¹		10		26
IHP SG13SCu FEOL process SG13S together with Cu BEOL option	11		26		25¹		10		26
IHP BEOL SG13 (M1 and Metal Layers Above) + optional LBE or TSV		26

Important notes: Dates are Registration deadlines. Final GDSII file must be submitted within 10 days after this date.

¹ Additional MPW runs offered only when the cumulative area > 10 mm²

² Additional MPW runs offered only when the cumulative area > 18 mm²

³ Additional MPW runs offered only when the cumulative area > 25 mm²

MEMRES is available for the IHP SG13S technology with extra charge only for the runs on 25 June and 26 November

TSV is available for IHP SG13S and SG13G2 technologies with extra charge

Cu Pillar and Bumping are available for all IHP technologies with extra charge

Local Backside Etching (LBE) is not offered for EPIC runs and runs with Cu-BEOL

IHP MPW Pricelist	Standard EUR / mm²	Disconunted EUR / mm²
IHP SGB25V 0.25μ SiGe:C Bipolar/Analog, Ft/Fmax= 75/95GHz, 5M/MIM, breakdown voltages up to 7V	2,500 ¹	2,125 ¹
IHP SG25H3 0.25μ SiGe:C Bipolar/Analog, Ft/Fmax= 110/180GHz, 5M/MIM, breakdown voltages up to 7V	3,800 ¹	3,230 ¹
SG25H5_EPIC Bipolar/Analog, Ft/Fmax= 250/300GHz, 7M/MIM + Photonics	8,000 ¹	6,800 ¹
IHP SG25 PIC (Photonics, Ge Photo-diode, BEOL)	3,800 ¹	3,230 ¹
IHP SG13S SiGe:C Bipolar/Analog, Ft/Fmax= 250/300GHz, 7M/MIM + optional TSV	6,300 ¹	5,355 ¹
IHP SG13C SiGe:C CMOS 7M/MIM	4,500 ¹	3,825 ¹
IHP SG13G2 SiGe:C Bipolar/Analog, Ft/Fmax= 300/500GHz, 7M/MIM + optional TSV	7,300 ¹	6,205 ¹
IHP SG13G2Cu FEOL process SG13G2 together with Cu BEOL option	7,000 ¹	5,950 ¹
IHP SG13SCu FEOL process SG13S together with Cu BEOL option	6,100 ¹	5,185 ¹
IHP BEOL SG13 (M1 and Metal Layers Above) + optional LBE or TSV	1,000 ¹	850 ¹
IHP Special Services
Bumping (available for all IHP technologies)	6,500²	6,500 ²
Localized Back side Etching (available for all IHP technologies) not offered for EPIC/PIC runs	5,000²	4,250 ²
TSV to ground (SG13)	7,500	7,500
Cu Pillar	18,500²	18,500²
MEMRES Module per run (offered only for SG13S)	2,500³	2,000³
MEMRES Modul mm² (offered only for SG13S)	600³	510³

Important notes:

¹ Price = area (mm²) * price/mm² with min. fabrication cost equivalent to 0.8mm².
The chip area is inclusive of the filler cells outside the seal ring.
² One-off fee
³ MEMRES is available for the IHP SG13S technology with extra charge only for the runs in June and November.

IHP MPW	Jan	Feb	Mar	Apr	Jun	Jul	Sep	Oct	Nov
IHP SGB25V 0.25µ SiGe:C Bipolar/Analog, Ft/Fmax= 75/95GHz, 5M/MIM, breakdown voltages up to 7V		5				23		22³
IHP SG25H3 0.25µ SiGe:C Bipolar/Analog, Ft/Fmax= 110/180GHz, 5M/MIM, breakdown voltages up to 7V		5				23		22²
SG25H5_EPIC Bipolar/Analog, Ft/Fmax= 250/300GHz, 7M/MIM + Photonics				16				22
IHP SG25 PIC (Photonics, Ge Photo-diode, BEOL)	22					30
IHP SG13S SiGe:C Bipolar/Analog, Ft/Fmax= 250/300GHz, 7M/MIM + optional TSV + optional MEMRES (only for the run on 26/11)	11		26¹		25		10		26
IHP SG13C SiGe:C CMOS 7M/MIM	11		26		25		10		26
IHP SG13G2 SiGe:C Bipolar/Analog, Ft/Fmax= 300/500GHz, 7M/MIM + optional TSV	11		26 ¹		25		10		26
IHP SG13G2Cu FEOL process SG13G2 together with Cu BEOL option	11		26		25¹		10		26
IHP SG13SCu FEOL process SG13S together with Cu BEOL option	11		26		25¹		10		26
IHP BEOL SG13 (M1 and Metal Layers Above) + optional LBE or TSV		26