The single electrode stack has a silicon substrate with an optional TOX (Thermal Oxide) layer, a Piezoelectric layer of AlScN and Molybdenum as the top electrode. This stack could further be used by any researcher / industry with in-house microfabrication capabilities to carry out post processing at their facility.
Single electrode layer stack | |
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Technology characteristics | 8 inch wafer (200 mm) Substrate: • 725um thickness Silicon, 200mm diameter • Type/Dopant: P/Boron • Orientation: <100> • Resistivity: 1 – 50 ohm-cm • Thickness: 725±25um Top Electrode: Molybdenum – 250 ±10nm thickness Optional TOX (Thermal Oxide): 1µm ± 10%Thickness Piezoelectric layer: AlScN with Sc-6.5% (at): 1± 10% µm thickness |
Special features
| Piezoelectric Layer of AlScN with D33 around 6 pC/N (As measured by Piezometer PM300)
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Application area
| PiezoMEMS sensors and actuators Energy Harvesting Ultrasonic transducers Medical applications Optics RF applications Biosensors Quantum physics applications Space applications etc. |
The dual electrode layer stack has a silicon substrate with TOX (Thermal oxide) layer, a bottom Molybdenum metal electrode, the Piezoelectric layer of AlScN and a Molybdenum top electrode. This stack could further be used by any researcher / industry with in-house microfabrication capabilities to carry out post processing at their facility.
Dual electrode layer stack | |
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Technology characteristics | 8 inch wafer (200 mm) Substrate: • 725um thickness Silicon, 200mm diameter • Type/Dopant: P/Boron • Orientation: <100> • Resistivity: 1 – 50 ohm-cm • Thickness: 725± 25um TOX (Thermal Oxide): 1µm ± 10%Thickness Top and bottom electrode: Molybdenum – 250 ± 10 nm thickness Piezoelectric layer: AlScN with Sc-6.5% (at): 1 ± 10% µm thickness |
Special features
| Piezoelectric Layer of AlScN with D33 around 6pC/N (As measured by Piezometer PM300)
|
Application area
| PiezoMEMS sensors and actuators Energy Harvesting Ultrasonic transducers Medical applications Optics RF applications Biosensors Quantum physics applications Space applications etc. |