Additional technology options are available:
On this page you can find General MPW and mini@sic run schedules and prices for 2026.
If you need the 2025 schedules, please click here.
There are two prices in the EUROPRACTICE lists: Discounted and Standard.
Three conditions should be met for Discounted prices:
Standard prices apply to all other customers.
To reserve your seat on a run, please register your design in the Registration Form or contact the EUROPRACTICE partner responsible for the technology.
STMicroelectronics MPW | Jan | Feb | Mar | Apr | May | Jun | Jul | Aug | Sep | Oct | Nov | Dec | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
ST BiCMOS55X | 3 | 21 | |||||||||||
ST BiCMOS9MW | 7 | ||||||||||||
ST CMOS28FDSOI | |||||||||||||
ST HCMOS9A | 5 | ||||||||||||
ST P28 | 18 |
Important notes: Dates are GDS submission deadlines. Design registration has to be done at least 4 weeks in advance.
STMicroelectronics MPW Pricelist | Standard EUR / mm² | Additional area beyond X mm² | Discount EUR / project | |
---|---|---|---|---|
ST BiCMOS55X | 5,500 | 4,2502 | 1,200 | |
ST BiCMOS9MW | 3,500 | 2,9502 | 1,000 | |
ST CMOS28FDSOI | 9,000 | 6,7501 | 1,500 | |
ST HCMOS9A | 3,550 | 3,1502 | 700 | |
ST P28 | 12,150 | 9,1001 | 1,500 |
Important notes:
All prices have a minimum charge of 1.25mm² including seal-ring.
Area = X*Y including seal-ring. The mentioned die size is referred to the Pre-Shrink die size.
Additional areas:
1 Between 2 and 10 mm²
2 Between 5 and 10 mm²
Reduced rate for additional mm² above 10mm²
TSMC MPW | Jan | Feb | Mar | Apr | May | Jun | Jul | Aug | Sep | Oct | Nov | Dec | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
TSMC 0.13µm CMOS BCD plus (12-inch) | 1 | 5 | 4 | ||||||||||
TSMC 0.13µm CMOS Logic or MS/RF, GP or LP (12-inch) | 1 | 5 | 4 | ||||||||||
TSMC 90nm CMOS Logic or MS/RF, GP or LP | 5 | ||||||||||||
TSMC 65nm CMOS Logic or MS/RF, GP or LP | 25 | 8 | 3 | 8 | 26 | 3 | 7 | 4 | |||||
TSMC 55nm CMOS Logic or MS/RF, GP or LP or ULP
| 3 | ||||||||||||
TSMC 40nm CMOS Logic or MS/RF, LP (no triple gate oxide) | 10 | 24 | 31 | 2 | 28 | 1 29 | 1 | ||||||
TSMC 40nm CMOS Logic or MS/RF, GP (no triple gate oxide) | 31 | 1 | |||||||||||
TSMC 28nm CMOS Logic or RF HPC/HPC+ | 21 | 18 | 22 | 20 | 29 | 26 | 29 | 28 | 25 | ||||
TSMC 22nm CMOS Logic or RF ULL | 18 | 1 29 | 17 | 22 | 19 | 21 | 18 | ||||||
TSMC 16nm CMOS Logic or RF FinFET Compact | 20 | 25 | 19 | 28 | 22 | 17 | |||||||
TSMC 7nm CMOS Logic or RF FinFET | 25 | * | * | * | * | * | * |
Important notes:
Dates are GDS submission deadlines.
Several TSMC shuttles are extremely loaded. For any technology, please make your design registration as early as possible. We will work with you and do our best to get your design on the run. If required, a waiting list will be created.
* The schedule for the period July to December will be published on 16 March 2026.
Bumping is available upon request for all 12-inch technologies.
Contact eptsmc@imec.be if any of the following options are used: Bumping, MTP/OTP.
Prices for TSMC technologies can be calculated through the online Price Request Form:
Exceptionally, prices for the TSMC University FinFET Program can be found here:
When 4 or more independent sub-designs are registered in one MPW submission to optimise the minimum charged area, an additional verification charge of 1,000 USD is applicable. This is regardless of the request and charges for sub die sawing (6 USD per additional die obtained from the base MPW submission).
TSMC mini@sic | Jan | Feb | Mar | Apr | May | Jun | Jul | Aug | Sep | Oct | Nov | Dec | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
TSMC 0.13µm CMOS BCD plus | 25 | 28 | |||||||||||
TSMC 65nm CMOS Low Power MS/RF | 18 | 22 | 30 | 26 | 28 | 10 * | |||||||
TSMC 65nm CMOS GP MS/RF | 31 | 30 | |||||||||||
TSMC 40nm CMOS Low Power MS/RF | 24 | 22 | |||||||||||
TSMC 28nm CMOS RF HPC+ | 14 | 15 | 13 | 22 | 21 | ||||||||
TSMC 16nm CMOS RF FinFET Compact | 18 | 10 | |||||||||||
Important notes:
Dates are GDS submission deadlines.
Several TSMC shuttles are extremely loaded. For any technology, please make your design registration as early as possible. We will work with you and do our best to get your design on the run. If required, a waiting list will be created.
* Please note that this date is tentative and may be adjusted.
Please check additional technology options for TSMC mini@sic:
Please check additional technology options for the TSMC University FinFET Program:
TSMC mini@sic Pricelist | Standard prices | Discounted prices | |||
---|---|---|---|---|---|
EUR / min area | EUR / extra area | EUR / min area | EUR / extra area | ||
TSMC 130 BCD+ (min area = 6 mm2) | 14,054 | 232 / 0.1 mm2 | 12,554 | 191 / 0.1 mm2 | |
TSMC 65 LP/GP MS RF (min area = 1 mm2) | 4,491 | 419 / 0.1 mm2 | 3,691 | 360 / 0.1 mm2 | |
TSMC 40 LP MS RF (min area = 3 mm2) 1 | 21,386 | 664 / 0.1 mm2 | 18,386 | 602 / 0.1 mm2 | |
TSMC 28 HPC+ RF (min area = 1 mm2) 1 | 10,609 | 919 / 0.1 mm2 | 8,509 | 834 / 0.1 mm2 | |
TSMC 16 FFC RF (min area = 1mm2) 2, 3 | 30,592 | 2,827 / 0.1 mm2 | 26,592 | 2,568 / 0.1 mm2 |
Important notes:
The prices are area based, and the aspect ratio is free to choose but it is strongly recommended not to have sides less than 1mm.
Subdicing is not supported on mini@sic.
Design registration must be done at least 3 months in advance, preferably at the moment of reservation.
1 The areas in the table for 28nm and 40nm are on-silicon dimensions. This means the designed area can be (area/0.81).
2 The areas in the table for 16nm indicates on-silicon dimensions. This means the designed area can be (area/0.9604).
Please check additional technology options for TSMC mini@sic:
UMC MPW | Jan | Feb | Mar | Apr | May | Jun | Jul | Aug | Sep | Oct | Nov | Dec | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
UMC 28N Logic/Mixed-Mode – HPC | 19 | 20 | 20 | 19 | |||||||||
UMC 40N Logic/Mixed-Mode – LP | 30 | 27 | 21 | 30 | |||||||||
UMC 65N Logic/Mixed-Mode/RF – LL | 6 | 6 | 28 | ||||||||||
UMC L110AE Logic/Mixed-Mode/RF | 9 | 27 | 29 | 31 | 23 | ||||||||
UMC L180 Logic GII, Mixed-Mode/RF | 6 | 28 |
Important notes: Dates are GDS submission deadlines. Design registration must be done at least 4 weeks in advance.
Additional technology options are available:
UMC MPW Pricelist | Standard EUR / block | Discounted EUR / block | |
---|---|---|---|
UMC L180 Logic GII, Mixed-Mode/RF | 19,000 1 | 18,060 1 | |
UMC L110AE Logic/Mixed-Mode/RF | 34,800 1 | 33,0601 | |
UMC L65nm Logic, Mixed-Mode/ RF – LL/SP | 50,600 2 | 48,080 2 | |
UMC 40N Logic/Mixed-Mode – LP | 98,050 2 | 93,160 2 | |
UMC 28N Logic/ Mixed-Mode – HPC | On request. Please, contact epumc@imec.be |
Important notes:
1 Price = per block of 5mm x 5mm needed to fit the design in.
2 Price = per block of 4mm x 4mm needed to fit the design in.
When four or more independent sub-designs are registered in one MPW submission to optimize the minimum charged area, an additional verification charge of 1,000 EUR will be applied.
UMC mini@sic | Jan | Feb | Mar | Apr | May | Jun | Jul | Aug | Sep | Oct | Nov | Dec | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
UMC L180 Mixed-Mode/RF | 30 | 21 |
Important notes: Dates are GDS submission deadlines. Design registration must be done at least 4 weeks in advance.
Additional technology options are available:
UMC mini@sic Pricelist | Standard EUR / block | Discounted EUR / block | |
---|---|---|---|
UMC L180 Mixed-Mode/RF – 1P6M – 1.8V/3.3V * | 4,110 1 | 3,430 1 |
Important notes:
1 Price = per block of 1525μm x 1525μm needed to fit the design in. Adding two blocks together to one block is possible.
* UMC 0.18μm mini@sic rules
When the standard block of 5mm x 5mm is divided into 9 regular square sub-blocks, customers participating in the mini@sic program can submit one sub-block or multiple sub-blocks, depending on the size of their design:
Final price = number of sub-blocks needed to fit in the design * sub-block price.