Since the lead time of assembly houses has increased over the last year, the EUROPRACTICE packaging lead time is now also slightly longer: up to 6 weeks.
It is important that our customers access packaging services via the same EUROPRACTICE partner that was responsible for the fabrication of their prototypes. For instance, if you had your prototypes fabricated via imec, you should also access packaging services through imec.
All packages require a setup cost of €440 per bonding diagram.
The prices below are valid for all packages and bonding of designs with the following requirements:
Minimum package order depends on the EUROPRACTICE partner you work with.
Fixed set-up cost for glass sealing for up to 30 pieces: 820 EUR.
Please make sure you follow ASIC Package Design Rules and download the GDS file containing available packages within EUROPRACTICE:
EUROPRACTICE packaging offer is wider than the options listed below. Please contact us for more details.
As mentioned above in PRICE STRUCTURE, all packages require a setup cost of €440 per bonding diagram.
Some assemblies may lead to further additional charges depending on the complexity. In the case of non-standard assembly some setup samples may be needed for validation. These setup parts may not be suited for further usage.
This is not a full list. More packages are available on request.
Standard Ceramic Packaging: Price per one item | |
|---|---|
Type | EUR |
Dual-in-line | |
DIL 16 | 61 |
DIL 18 | 86 |
DIL 24 | 79 |
DIL 28 | 84 |
DIL 40 | 88 |
DIL 48 | 104 |
Ceramic Small Outline Integrated Circuit | |
CSOIC 16 | 113 |
CSOIC20 | 130 |
CSOIC24 | 135 |
CSOIC 28 | 140 |
C-Leadless Chip Carriers | |
CLCC 44 | 88 |
CLCC 68 | 123 |
CLCC 84 | 125 |
J-Leaded Chip Carriers | |
JLCC44 | 104 |
JLCC 68 | 135 |
JLCC 84 | 155 |
Ceramic Pin Grid Array | |
CPGA 100 | 153 |
CPGA 120 | 170 |
CPGA 144 | 195 |
CPGA 208 | 299 |
CPGA 256 | 390 |
Ceramic Quad Flat Package | |
CERQUAD FP 64 | 140 |
CERQUAD FP 120 | 195 |
CERQUAD FP 128 | 198 |
CERQUAD FP 160 | 225 |
CERQUAD FP 208 | 283 |
The silicon thickness for “Open-Pak” plastic types may not exceed 280µm (11 mils). Please check it with the partner responsible for the technology in question.
For the QFN packages, EUROPRACTICE uses default epoxy sealed lids. “Taped” lids can be provided on request and responsibility of the customer. However, we cannot guarantee that “taped” lids do not come loose during transport. EUROPRACTICE takes no responsibility in this case.
This is not a full list. More packages are available on request.
Plastic “Open-Pak” Packages: Price per one item | |
|---|---|
Type | EUR |
Small Outline IC | |
SOIC 16 | 113 |
SOIC 20 | 130 |
SOIC 24 | 135 |
SOIC 28 | 140 |
Quad-Flat No-leads | |
QFN 12 (4×4) | 74 |
QFN 16 (5×5) | 80 |
QFN 20 (5×5) | 86 |
QFN 24 (5×5) | 93 |
QFN 24 (6×6) | 93 |
QFN 28 (4×4) | 99 |
QFN 28 (5×5) | 99 |
QFN 28 (6×6) | 99 |
QFN 32 (5×5) | 109 |
QFN 32 (7×7) | 109 |
QFN 36 (6×6) | 115 |
QFN 40 (5×5) | 125 |
QFN 40 (6×6) | 125 |
QFN 48 (7×7) | 128 |
QFN 56 (8×8) | 130 |
QFN 64 (9×9) | 166 |
QFN 80 (12×12) | 174 |
QFN 88 (10×10) | 183 |
QFN 100 (12×12) | 205 |
Plastic packages for small quantities (<100 units)
Novel applications and prototypes sometimes need customised assembly. Therefore, together with standard packaging, EUROPRACTICE offers a wide range of custom solutions, ranging from simple custom wirebonds to complex multilayer optoelectronic sub-assembly.
To benefit from customized packaging solutions, please contact one of the EUROPRACTICE partners:
