45SPCLO is a 45 nm generation, SOI, CMOS technology that supports (ASIC) designs and custom logic designs. It offers power, area, and performance advantages and efficiency providing more data per watt per fibre per Laser. Monolithic integration of RF, digital and Si-Photonic circuits with higher energy efficiency and higher modulation speed. Ideal for applications like Automotive Lidar, IoT, Cloud, Frictionless Networking, Virtualization and Hierarchical AI.
GF 45 SPCLO Silicon-Photonics | |
|---|---|
Technology characteristics | CMOS technology substrate resistivity is in the range of 9-18 ohm-cm Core Voltages: 0.9V, 1V, IO Voltages: 1.5V, 1.8V 1.12 nm thin gate oxide for 0.9 V 2.5 nm thick gate oxide for 1.5 V and 1.8 V Mini. lithographic image of 40 nm (gate only) Operating junction temperature: -40°C to 125°C One BEOL STACK options: 9LM Metallization stack Seven levels of all-copper global metal 1x, 2x, and 8x thick wires at relaxed pitches Low-K and TEOS/FTEOS Inter Level Dielectrics Planarized passivation and interlevel dielectrics High-value resistor 1.5K Ohms/square |
Photonic offering
| C-band (1550 nm) coherent transceivers modules O-band (1310 nm) direct detect transceivers |
Photonic waveguide
| Polarization splitter & rotator, modulators, detectors Phase shifter, connection options (Polymer bundle or Fiber Butt) Vertical grating incoupler: iograt |
Device offering
| Regular Vt, floating-body FETs Ultrahigh Vt, floating-body FETs Analog, body-contacted FETs Thick-oxide, body-contacted FETs Precision resistors,Thick-oxide decoupling capacitor Efuse, Ge EPI Photo diode, Nitride wave guide in MOL |
Wafer size
| 12inch
|
Manufacturing location
| Fab8 – Malta, New York, USA
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Deliverables
| 50 dies for general MPW and 50 dies for mini@sic run
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Signoff tools
| Cadence, Synopsys, Siemens EDA
|
Dummy filling
| By customer
|
MPW block size
| 25mm² with fix dimensions of 5mm x 5mm
|
MPW Turnaround time
| 5-6 months
|
Mini@sic characteristics
| Supported Block size: 5mm x 2.455mm or 2.455mm x 5mm (Pre-Shrink die size) |
Bumping
| Upon request |
