Prototyping & Fabrication Services

AMO

2D-PL Technologies

GRAPHENE-BASED DEVICES: GFETs

This MPW run of the 2D-PL project is mainly intended towards electronics but can also include sensor devices (e.g. Hall sensor, but via opening on graphene is not in the scope of this run) and will be provided by AMO GmbH. The design of the device can be adjusted within the specifications. The offered device structure is the GFET shown in the following image.

Scheme with the different layers of the final GFET structure.

DESCRIPTION

KEY FABRICATION STEPS
  • Local Back gate (Au or Pd)
  • Dielectric deposition & vias opening
  • Bottom contacts fabrication (as local BG)
  • Wafer-scale graphene transfer & patterning
  • Encapsulation & vias opening (not on top of graphene)
  • Optional: Au Bondpads

KEY PARAMETERS

Parameter
Value
Graphene Mobility
>1000 cm²/Vs
Avg. Sheet Resistance
n=-5 x 1012 cm-2:
~1 kΩ
Avg. Contact Resistance
n=-5 x 1012 cm-2:
~1 kΩ µm
Minimum working devices
>80 %
Dirac point
-10V … +10V
Safe gate-source voltage range
± 20 V
KEY FEATURES

Substrate

  • Material: Silicon/SiO(90nm)
    • Si Resistivity 1-10 Ohm-cm
    • Thickness 675+/-25µm
  • Basic die size: 1 x 1 cm²

Resolution

General design rule: 10 μm for in-layer critical dimension and over-layer alignment.

Layer thicknesses
0
Rigid Substrate
Si/SiO2
90 nm
1
Back Gate Contact
Ti/Pd or Ti/Au
5 nm /40 nm
2
Dielectric Layer
Al2O3
40 nm
3
Bottom Contact
as layer 1
5 nm /40 nm
4
Graphene
Single layer, CVD on Cu
5
Encapsulation
Al2O3
40 nm
6
Bondpads
Au
300 nm

Characterization

  • Raman characterization
  • Electrical measurement for as-fabricated reference devices
  • General optical inspection of your devices
Important Dates
  • 17 November 2025 – 29 May 2026: Application phase. During the application phase, interested clients can fill in the form here or contact us via the contact provided and receive further information about the run in the first meeting
  • 22 June 2026: Deadline for layout submission and PO
  • 1 June 2026 – 31 August 2026: Internal preparation
  • 1 September 2026 – 31 October 2026: MPW run execution
  • 1 – 30 November 2026: MPW run delivery
 
Price
  • 3600€ set price for 8 dies with identical design (1×1 cm²)
  • Each die more with identical design costs 450€ more