CORNERSTONE

Technologies

EUROPRACTICE offers access to the various 200mm Silicon Photonics SOI platforms offered by CORNERSTONE.

 

The open source, license free rapid prototyping platform offers unparalleled flexibility in its MPW runs, with the option to customize certain steps.

 

Passive SOI calls include 2/3 etch depths and optional TiN based thermal phase shifters, whilst active SOI calls also include carrier based optical modulators. SiN calls offer a single etch process and optional TiN based thermal phase shifters. The suspended-Si platform is based on 500 nm SOI and undercuts the BOX layer to extend the Si waveguide transparency up to ~8 µm. The Ge-on-Si platform further extends the waveguide transparency up to ~14 µm.

 

Unlike many other rapid prototyping services, CORNERSTONE utilizes DUV lithography, but also offers the unique capability to pattern certain layers using high resolution e-beam lithography.

CORNERSTONE Si-Photonics 220 nm SOI Passives
Highlights
Ability to customize certain steps
Optional use of e-beam lithography for high resolution layers
Open source PDK available
No license required
Rapid turn-around
Option for design consultancy
Technology Characteristics
2 Si etch depths: 70 nm & 220 nm
TiN based thermal phase shifters
Option for no cladding if no heaters are required
Design Tools
Luceda Photonics’ IPKISS platform
Application
Datacoms, telecoms, LIDAR
CORNERSTONE Si-Photonics 220 nm SOI Actives
Highlights
Ability to customize certain steps
Optional use of e-beam lithography for high resolution layers
Open source PDK available
No license required
Option for design consultancy
Technology Characteristics
High resistivity handle wafer (750 ohm.cm)
3 Si etch depths: 70 nm, 120 nm & 220 nm
4 implantation levels for carrier based modulators
1 metal layer for ohmic contacts
Design Tools
Luceda Photonics’ IPKISS platform
Application
Datacoms, telecoms, LIDAR
CORNERSTONE Si-Photonics 340 nm SOI Passives
Highlights
Lower loss platform
Ability to customize certain steps
Optional use of e-beam lithography for high resolution layers
Open source PDK available
No license required
Rapid turn-around
Option for design consultancy
Technology Characteristics
2 Si etch depths: 140 nm & 340 nm
TiN based thermal phase shifters
Option for no cladding if no heaters are required
Design Tools
Luceda Photonics’ IPKISS platform
Application
Datacoms, telecoms, quantum photonics, LIDAR
CORNERSTONE Si-Photonics 500 nm SOI Passives
Highlights
Ability to support mid-IR wavelengths
Low loss platform
Ability to customize certain steps
Optional use of e-beam lithography for high resolution layers
Open source PDK available
No license required
Rapid turn-around
Option for design consultancy
Technology Characteristics
2 Si etch depths: 160 nm & 300 nm
TiN based thermal phase shifters
Option for no cladding if no heaters are required
Design Tools
Luceda Photonics’ IPKISS platform
Application
Mid-IR applications including sensing, datacoms, telecoms, quantum photonics
CORNERSTONE SiN-Photonics
Highlights
Ability to support mid-IR wavelengths
Low loss platform
Ability to customize certain steps
Optional use of e-beam lithography for high resolution layers
Open source PDK available
No license required
Rapid turn-around
Option for design consultancy
Technology Characteristics
300 nm LPCVD SiN layer
3 μm BOX
300 nm SiN etch depth
TiN based thermal phase shifters
Option for no cladding if no heaters are required
Design Tools
Luceda Photonics’ IPKISS platform
Application
Applications include sensing, datacoms, telecoms, quantum photonics, LiDAR
CORNERSTONE Suspended-Si
Highlights
Ability to support mid-IR wavelengths up to ~8 µm
Ability to customize certain steps
Optional use of e-beam lithography for high resolution layers
Open source PDK available
No license required
Rapid turn-around
Option for design consultancy
Technology Characteristics
500 nm SOI
3 μm BOX
500 nm full Si etch depth
BOX layer locally removed underneath suspended waveguides by HF etching
Design Tools
Luceda Photonics’ IPKISS platform
Application
Applications are centred around gas and chemical sensing
CORNERSTONE Ge-on-Si
Highlights
Ability to support mid-IR wavelengths up to ~14 µm
Ability to customize certain steps
Open source PDK available
No license required
Rapid turn-around
Option for design consultancy
Technology Characteristics
3 µm Ge waveguide layer
1.8 µm Ge partial etch depth
Edge coupling possible using diced waveguide facets
Design Tools
Luceda Photonics’ IPKISS platform
Application
Applications are centred around gas and chemical sensing