This is an overview of the most popular TSMC technologies. You can find more technology flavours in the ‘Details’ section below.
From now on, customers can also get access to the backend views of standard cell libraries, as long as there is a firm tape out plan. To request the access, please complete this form.
Your request will be reviewed by TSMC. We would like to warn you that the review procedure can take up to 3 months due to high number of applications.
0.13µm Low Power BCD Plus is a 12 inch, automotive qualified, technology targeted towards highly integrated mobile PMIC applications. It’s based on 0.13µm Low Power MS to which it adds HV MOSFET and BJT devices up to 36V, and offers up to 3 gate voltage options (1.5/3.3/5V).
0.13µm CMOS High Voltage, Low Power, BCD Plus | |
|---|---|
Technology characteristics | Shrink technology: NO Core voltage: 1.5V I/O voltage: 5V (dual gate voltage) or 3.3V/5V (triple gate voltage) HV transistors (Vds): 10/12/16/20/24/28/36V STI Wells: Retrograde well CMOS technology on <100> P- substrate wafer. Six LV wells, three HV wells and N+ Buried Layer (NBL) Substrate resistivity 8~12 ohm.cm on <100> P- substrate Standard Vt, Low Vt, Native Vt Temperature range: -40C to 150C # of metals: 4 or 6 (copper metals) + 1 (optional) aluminium redistribution layer * Interconnect material: Copper (first 6 metal layers) Interconnect dielectric: FSG (FluoroSilicate Glass) Top metal: 8KA only ** CMP on STI, contact, via and inter-metal dielectric layers MoM MiM density: 1fF/µm2 or 1.5fF/µm2, mutual exclusive Passivation: single (default; no aluminium RDL) or dual (optional; when aluminum RDL is required) OTP (from TSMC & 3rd party) / MTP (only 3rd party) |
Wafer size | 12 inch
|
Deliverables | # of dies (no wafer!): 100 dies / wafer |
Design tools | PDK: Cadence CDBA and OA |
Simulation tools | Hspice, Spectre |
Verification tools DRC | Cadence (PVS), Siemens EDA (Calibre), Synopsys (ICV) |
Verification tools LVS
| Cadence, Siemens EDA, Synopsys |
Parasitic extraction tools
| Cadence, Siemens EDA, Synopsys |
P&R tools
| Cadence, Siemens EDA, Synopsys
|
Foundry IP
| Standard cell libraries available from 3rd party IP providers (ARM, Dolphin, …) 1.5V/3.3V, hybrid linear slim I/O library that contains both standard and analog slim I/O SRAM compilers available from 3rd parties eFuse (from TSMC; paying option) |
MPW block size
| Min. 25 mm2, flexible aspect ratio
|
Mini@sic characteristics
| Supported Min area: 6mm2 |
* More options may become available at a later stage. TSMC can process 3 to 6 metals and UTM is possible, but no PDK installation currently supports these options.
** 33KA UTM may become available at a later stage. TSMC can process UTM, and UTM is mentioned as an option in the DRM, but no PDK installation currently supports this option.
For applications in consumer electronics, computers, mobile computing, automotive electronics, IoT, and smart wearables.
0.13µm CMOS Logic or MS/RF, General Purpose | |
|---|---|
Technology characteristics | Shrink technology: NO Core voltage: 1.2V I/O voltage: 2.5 or 3.3V Shallow Trench Isolation (STI) Wells: Retrograde twin well cmos technology on <100> P-substrate. Substrate resistivity 8-12ohm-cm Tripple Well, Deep N-well (optional) Vt options: lvt, svt, hvt,uhvt, native Temperature range: -40C to 125C # of metals: 3 to 8 +ALRDL Interconnect dielectric: FSG Top metal: 8KA CMP on STI, contact, via and inter-metal dielectric layers MoM Varactors |
MS/RF options | MIM capacitor for MS & RF process: 1fF/µm2 High-Q copper inductor Top metal: UTM, 33.5K Single passivation, Dual passivation optional |
Wafer size | 12 inch
|
Deliverables | # of dies (no wafer!): 40-dies (8″), 100 dies (12″) / wafer
|
Design tools | PDK: Cadence CDBA and OA, Mentor
|
Simulation tools | HSPICE, Eldo, Spectre
|
Verification tools DRC | Cadence, Siemens EDA
|
Verification tools LVS
| Cadence, Siemens EDA
|
Parasitic extraction tools
| Cadence, Siemens EDA
|
P&R tools
| Cadence, Siemens EDA, Synopsys
|
Foundry IP
| 9-track core cell library, with 5V I/O devices, SVt 1.2/3.3V regular,linear universal standard I/O 1.2V/2.5V & 1.2/3.3V Universal Analog I/O compatible with Linear Universal Standard I/O 1.2V/2.5V & 1.2/3.3V , hybrid linear slim I/O library that contains both standard and analog slim I/O 5V tolerant, linear universal standard I/O 1.2V/3.3V, 5V tolerant, staggered universal standard I/O SRAM compilers from 3rd party |
MPW block size
| Min. 25 mm2, flexible aspect ratio
|
Mini@sic characteristics
| Not supported
|
For applications in consumer electronics, computers, mobile computing, automotive electronics, IoT, and smart wearables.
0.13µm CMOS Logic or MS/RF, Low Power | |
|---|---|
Technology characteristics | Shrink technology: NO Core voltage: 1.5V I/O voltage: 2.5 or 3.3V Shallow Trench Isolation (STI) Wells: Retrograde twin well cmos technology on <100> P-substrate. Substrate resistivity 8-12ohm-cm Tripple Well, Deep N-well (optional) Vt options: lvt, svt, native Temperature range: -40C to 125C # of metals: 3 to 8 (CU) (+ALRDL) Interconnect dielectric: FSG Top metal: 8KA CMP on STI, contact, via and inter-metal dielectric layers MoM Varactors |
MS/RF options | MIM capacitor for MS & RF process: 1fF/µm2 High-Q copper inductor Top metal: UTM, 33.5K Single passivation, Dual passivation optional |
Wafer size | 12 inch
|
Deliverables | # of dies (no wafer!): 40-dies (8″), 100 dies (12″) / wafer
|
Design tools | PDK: Cadence CDBA and OA, Mentor
|
Simulation tools | HSPICE, Eldo, Spectre
|
Verification tools DRC | Cadence, Siemens EDA
|
Verification tools LVS
| Cadence, Siemens EDA
|
Parasitic extraction tools
| Cadence, Siemens EDA
|
P&R tools
| Cadence, Siemens EDA, Synopsys
|
Foundry IP
| 9-track core cell library
|
MPW block size
| Min. 25 mm2, flexible aspect ratio
|
Mini@sic characteristics
| Not supported
|
This is a general-purpose product for applications with a 1.0V core design and with 1.8, 2.5 or 3.3V capable IO’s for digital consumer, Networking , HDD and FPGA.
90nm CMOS Logic or MS/RF, General Purpose | |
|---|---|
Technology characteristics | Shrink technology: NO Core voltage: 1.0V I/O voltage: 1.8, 2.5 or 3.3V Shallow Trench Isolation (STI) Wells: Retrograde twin well cmos technology on P-substrate Tripple Well, Deep N-well (optional) Multiple Vt options (lvt, svt, hvt, native) Dual gate oxide and tripple gate oxide process Temperature range: -40C to 125C # of metals: 3 to 9 (+ALRDL) Interconnect material: Cu + AlCu pad LK inter-metal dielectric for thin metal Top metal: 5.6 KA, 8.5KA CMP on STI, contact, via and inter-metal dielectric layers MoM |
MS/RF options
| MIM capacitor for MS & RF process: 1.0, 1.5, 2.0 fF/µm2(mutually exclusive) High-Q copper inductor Top metal: UTM, 34KA Varactors Dual passivation |
Options that need special attention
| Fuse RAM
|
Wafer size | 12 inch
|
Deliverables | # of dies (no wafer!): 100 dies / wafer (12″)
|
Design tools | PDK: Cadence CDBA, Cadence OA, Mentor, iPDK
|
Simulation tools | Hspice, Eldo, Spectre
|
Verification tools DRC | Cadence, Siemens EDA
|
Verification tools LVS
| Cadence, Siemens EDA
|
Parasitic extraction tools
| Cadence, Siemens EDA
|
P&R tools
| Cadence, Siemens EDA, Synopsys
|
Foundry IP
| 7,9,14-track core cell library, multi-Vt 1.0V/2.5V &1.0V/3.3V hybrid staggered slim I/O library that contains both standard and analog slim I/O 1.0V/2.5V &1.0V/3.3V linear staggered slim I/O library that contains both standard and analog slim I/O 1.0v/2.5v, 3.3v tolerant, staggered universal standard I/O 1.0V/3.3V, 5V Tolerant, Staggered Universal Standard I/O SRAM compilers from 3rd party |
MPW block size
| 16 mm2, flexible aspect ratio
|
Mini@sic characteristics
| Not supported
|
This is a general-purpose product for applications with a 1.2V core design and with 2.5 or 3.3V capable IO’s for mobile applications, such as Cellular, WLAN, BT.
90nm CMOS Logic or MS/RF, Low Power | |
|---|---|
Technology characteristics | Shrink technology: NO Core voltage: 1.2V I/O voltage: 2.5 or 3.3V Shallow Trench Isolation (STI) Wells: Retrograde twin well cmos technology on P-substrate Tripple Well, Deep N-well (optional) Multiple Vt options (ulvt, lvt, svt, hvt, native) Dual gate oxide and tripple gate oxide process Temperature range: -40C to 125C # of metals: 3 to 9 (CU) (+ALRDL) Interconnect material: Cu + AlCu pad LK inter-metal dielectric for thin metal Top metal: 5.6 KA, 8.5KA CMP on STI, contact, via and inter-metal dielectric layers MoM Varactors |
MS/RF options
| MIM capacitor for MS & RF process: 1.0, 1.5, 2.0 fF/µm2(mutually exclusive) Ultra Low Vt High-Q copper inductor Top metal: UTM, 34KA Dual passivation |
Options that need special attention
| Fuse RAM
|
Wafer size | 12 inch
|
Deliverables | # of dies (no wafer!): 100 dies / wafer (12″)
|
Design tools | PDK: Cadence CDBA and OA
|
Simulation tools | Hspice, Eldo, Spectre
|
Verification tools DRC | Cadence, Siemens EDA
|
Verification tools LVS
| Cadence, Siemens EDA
|
Parasitic extraction tools
| Cadence, Siemens EDA
|
P&R tools
| Cadence, Siemens EDA, Synopsys
|
Foundry IP
| 7,9,14-track core cell library, multi-Vt 1.2v/2.5v &1.2V/3.3V Universal Analog I/O compatible with Linear Universal Standard I/O 1.2V/2.5V & 1.2V/3.3V Regular, Linear Universal Standard I/O 1.2V/3.3V, regular, linear standard slim I/O 1.2V/3.3V, hybrid staggered slim I/O library that contains both standard and analog slim I/O SRAM compilers from 3rd party |
MPW block size
| 16 mm2, flexible aspect ratio
|
Mini@sic characteristics
| Not supported
|
It is a popular and well supported node.
65nm CMOS Logic or MS/RF, General purpose | |
|---|---|
Technology characteristics | Shrink technology: NO Core voltage: 1.0V I/O voltage: 2.5V (1.8V underdrive, 3.3V overdrive) Shallow Trench Isolation (STI) Wells: Retrograde twin well for low well sheet resistance and better latch-up behavior. Optional Deep N-Well <100> P- substrate wafer. Substrate resistivity 8-12ohm-cm Dual Gate Oxide (1 for core, 1 for IO) Vt options: lvt, svt, hvt, native Temperature range: -40C to 125C # of metals: 3 to 9 Cu + alrdl Interconnect dielectric: LK Top metal: 5KA, 9KA, 12.5KA, 34KA CMP on STI, contact, metals, vias and passivation MoM MiM density: 1fF/µm2, 1.5fF/µm2 or 2fF/µm2, mutually exclusive Passivation: dual layers |
Options that need special attention
| OTP/MTP SRAM Cell |
Wafer size | 12 inch
|
Deliverables | # of dies (no wafer!): 100 dies / wafer
|
Design tools | PDK: Cadence CDBA and OA, TSMC iPDK, Mentor
|
Simulation tools | HSPICE, Eldo, Spectre
|
Verification tools DRC | Cadence, Siemens EDA, Synopsys, Magma, TSMC iDRC
|
Verification tools LVS
| Cadence, Siemens EDA, Synopsys, Magma
|
Parasitic extraction tools
| Cadence, Siemens EDA, Synopsys
|
P&R tools
| Cadence, Siemens EDA, Synopsys
|
Foundry IP
| 12-track / 10-track / 9-track core cell libraries, multi-vt, coarse grain 1.0V/2.5V staggered (fail-safe digital, 5V input tolerant digital, hybrid small footprint digital/analog and regular analog) I/O library SRAM compilers from 3rd party |
MPW block size
| 12 mm2
|
Mini@sic characteristics
| Not supported
|
It is a popular and well supported node.
65nm CMOS Logic or MS/RF, Low Power | |
|---|---|
Technology characteristics | Shrink technology: NO Core voltage: 1.2V I/O voltage: 2.5V (1.8V underdrive, 3.3V overdrive) Shallow Trench Isolation (STI) Wells: Retrograde twin well for low well sheet resistance and better latch-up behavior. Optional Deep N-Well <100> P- substrate wafer. Substrate resistivity 8-12ohm-cm Dual Gate Oxide (1 for core, 1 for IO) Vt options: lvt, svt, hvt, mLowvt, native Temperature range: -40C to 125C # of metals: 3 to 9 Cu + alrdl Interconnect dielectric: LK Top metal: 5KA, 9KA, 12.5KA, 34KA CMP on STI, contact, metals, vias and passivation MoM MiM density: 1fF/µm2, 1.5fF/µm2 or 2fF/µm2, mutually exclusive Passivation: dual layers |
Options that need special attention
| OTP/MTP SRAM Cell |
Wafer size | 12 inch
|
Deliverables | # of dies (no wafer!): 100 dies / wafer
|
Design tools | PDK: Cadence CDBA and OA, TSMC iPDK, Mentor
|
Simulation tools | HSPICE, Eldo, Spectre
|
Verification tools DRC | Cadence, Siemens EDA, Synopsys, Magma, TSMC iDRC
|
Verification tools LVS
| Cadence, Siemens EDA, Synopsys, Magma
|
Parasitic extraction tools
| Cadence, Siemens EDA, Synopsys
|
P&R tools
| Cadence, Siemens EDA, Synopsys
|
Foundry IP
| 12-track / 10-track / 9-track / 7-track core cell libraries, multi-vt, coarse grain 1.2V/2.5V staggered (fail-safe digital, 5V input tolerant digital, hybrid small footprint digital/analog and regular analog) I/O library 1.2V/2.5V linear (digital, hybrid small footprint digital/analog and regular analog) I/O library SRAM compilers |
MPW block size
| 12 mm2
|
Mini@sic characteristics
| |
Well supported advanced node, 40G = 45GS.
40nm CMOS Logic or MS/RF, General Purpose | |
|---|---|
Technology characteristics | Shrink technology: YES Core voltage: 0.9V I/O voltage: 2.5V (1.8V underdrive, 3.3V overdrive) or true 1.8V Shallow Trench Isolation (STI) Wells: Retrograde twin well for low well sheet resistance and better latch-up behavior. Optional Deep N-Well <110> P- substrate wafer. Substrate resistivity 8-12ohm-cm Dual Gate Oxide (1 for core, 1 for IO) Vt options: lvt, svt, hvt, native Temperature range: -40C to 125C # of metals: 3 to 10 Cu + alrdl Interconnect dielectric: ELK Top metal: 3.1KA, 9KA, 12.5KA, 34KA CMP on STI, contact, metals, vias and passivation MoM Passivation: dual layers |
Options that need special attention
| OTP/MTP SRAM Cell |
Wafer size | 12 inch
|
Deliverables | # of dies (no wafer!): 100 dies / wafer
|
Design tools | PDK: Cadence CDBA and OA, TSMC iPDK
|
Simulation tools | HSPICE, Eldo, Spectre
|
Verification tools DRC | Cadence, Siemens EDA, Synopsys, Magma, TSMC iDRC
|
Verification tools LVS
| Cadence, Siemens EDA, Synopsys, Magma, TSMC iLVS
|
Parasitic extraction tools
| Cadence, Siemens EDA, Synopsys
|
P&R tools
| Cadence, Siemens EDA, Synopsys
|
Foundry IP
| 12-track / 9-track core cell libraries, multi-vt, coarse grain 0.9V/1.8V staggered (fail-safe digital, 5V input tolerant digital and regular analog) I/O library 0.9V/2.5V staggered (fail-safe digital, 5V input tolerant digital and regular analog) I/O library SRAM compilers |
MPW block size
| 9 mm2
|
Mini@sic characteristics
| Not supported
|
It is a well supported advanced node.
40nm CMOS Logic or MS/RF, Low Power | |
|---|---|
Technology characteristics | Shrink technology: YES (90% linear shrink) Core voltage: 1.1V I/O voltage: 2.5V (1.8V underdrive, 3.3V overdrive) Shallow Trench Isolation (STI) Wells: Retrograde twin well for low well sheet resistance and better latch-up behavior. Optional Deep N-Well <110> P- substrate wafer. Substrate resistivity 8-12ohm-cm Dual Gate Oxide (1 for core, 1 for IO) Vt options: lvt, svt, hvt, native Temperature range: -40C to 125C # of metals: 3 to 10 Cu + alrdl Interconnect dielectric: ELK Top metal: 3.1KA, 9KA, 12.5KA, 34KA CMP on STI, contact, metals, vias and passivation MoM Passivation: dual layers |
Options that need special attention
| OTP/MTP SRAM Cell |
Wafer size | 12 inch
|
Deliverables | # of dies (no wafer!): 100 dies / wafer
|
Design tools | PDK: Cadence CDBA and OA, TSMC iPDK, Mentor
|
Simulation tools | HSPICE, Eldo, Spectre
|
Verification tools DRC | Cadence, Siemens EDA, Synopsys, Magma, TSMC iDRC
|
Verification tools LVS
| Cadence, Siemens EDA, Synopsys, Magma, TSMC iLVS
|
Parasitic extraction tools
| Cadence, Siemens EDA, Synopsys
|
P&R tools
| Cadence, Siemens EDA, Synopsys
|
Foundry IP
| 12-track / 9-track core cell libraries, multi-vt, coarse grain 1.1V/2.5V staggered (fail-safe digital, 5V input tolerant digital, hybrid small footprint digital/analog and regular analog) I/O library SRAM compilers |
MPW block size
| 9 mm2
|
Mini@sic characteristics
| |
The TSMC 28nm technology is the most performant planar mainstream solution that evolved through the years due to constant enhancements in the manufacturing process. It supports a wide range of applications, including CPUs, GPUs, high-speed networking chips, smart phones, APs, tablets, home entertainment, consumer electronics, automotive and IoT.
The 28nm RF (28HPC+ RF) technology also provides support for 110GHz mmWave and for 5G mmWave RF.
28nm CMOS HPC+ Logic, RF | |
|---|---|
Technology characteristics | Shrink technology: YES Core voltage: 0.9V I/O voltage: – MPW (1.8V or 2.5V), – mini@sic (1.8V only) Shallow Trench Isolation (STI) Wells: Retrograde twin well for low well sheet resistance and better latch-up behavior. Triple well, Deep N-Well in option Dual Gate Oxide Vt options (only 4 out of 7): ulvt, lvt, hvt, uhvt, ehvt, sram, sram_ull 1.8V I/O based 5V HVMOS: Not offered for RF HPC+ flavor HighRes resistors Temperature range: -40C to 125C # of metals: 5 to 10 Cu + ALRDL Interconnect dielectric: ELK Top metal: Up to 35kA (please check with eptsmc@imec.be first) CMP on STI, contact, via and passivation MoM capacitor Passivation: dual layers |
Options that need special attention
| SRAM Cell (GL, ULL) Vt’s: maximum of 4 VT types in one design. |
Wafer size | 12 inch
|
Deliverables | 100 dies, no wafer
|
Design tools | PDK: TSMC iPDK
|
Simulation tools | HSPICE, Eldo, Spectre
|
Verification tools DRC | Cadence, Siemens EDA, Synopsys
|
Verification tools LVS
| Cadence, Siemens EDA, Synopsys
|
Parasitic extraction tools
| Cadence, Siemens EDA, Synopsys
|
P&R tools
| Cadence, Siemens EDA, Synopsys
|
Foundry IP
| 12-track / 9-track / 7-track core cell libraries, multi-vt’s 0.9V/1.8V hybrid staggered (fail-safe digital and regular analog) I/O library SRAM compilers by TSMC , ARM, Synopsys |
MPW block size
| 6mm² (on silicon)
|
Mini@sic characteristics
| |
The TSMC 28nm technology is the most performant planar mainstream solution that evolved through the years due to constant enhancements in the manufacturing process. It supports a wide range of applications, including CPUs, GPUs, high-speed networking chips, smart phones, APs, tablets, home entertainment, consumer electronics, automotive and IoT.
28nm CMOS HPC Logic, RF | |
|---|---|
Technology characteristics | Shrink technology: YES Core voltage: 0.9V I/O voltage: MPW (1.8V or 2.5V) Shallow Trench Isolation (STI) Wells: Retrograde twin well for low well sheet resistance and better latch-up behavior. Triple well, Deep N-Well in option Dual Gate Oxide Vt options (only 4 out of 7): ulvt, lvt, hvt, uhvt, ehvt, sram, sram_ull 1.8V I/O based 5V HVMOS HighRes resistors Temperature range: -40C to 125C # of metals: 5 to 10 Cu + ALRDL Interconnect dielectric: ELK Top metal: Up to 35kA (please check with eptsmc@imec.be first) CMP on STI, contact, via and passivation MoM capacitor Passivation: dual layers |
Options that need special attention
| SRAM Cell (GL, LL) Vt’s: maximum of 4 VT types in one design. |
Wafer size | 12 inch
|
Deliverables | 100 dies, no wafer
|
Design tools | PDK: TSMC iPDK
|
Simulation tools | HSPICE, Eldo, Spectre
|
Verification tools DRC | Cadence, Siemens EDA, Synopsys
|
Verification tools LVS
| Cadence, Siemens EDA, Synopsys
|
Parasitic extraction tools
| Cadence, Siemens EDA, Synopsys
|
P&R tools
| Cadence, Siemens EDA, Synopsys
|
Foundry IP
| 12-track / 9-track / 7-track core cell libraries, multi-vt’s 0.9V/1.8V hybrid staggered (fail-safe digital and regular analog) I/O library SRAM compilers by TSMC , ARM, Synopsys |
MPW block size
| 6mm² (on silicon)
|
Mini@sic characteristics
| Not supported |
TSMC’s 22nm process caters to the needs of a wide spectrum of industries, including mobile devices, automotive electronics, and IoT applications, providing a versatile solution for diverse market requirements. It comes in two flavors: 22ULP and 22ULL, where 22ULP is improving on 28HPC+ with device boost, area shrink and RF enhancements. 22ULL is adding ULL SRAM, eNVM (MRAM/RRAM) and eHVT devices.
22nm CMOS ULP and ULL | |
|---|---|
Technology characteristics | Shrink technology: YES (85.5% linear shrink from 32nm) Core voltage: 0.8V I/O voltage: 1.8V or 2.5V Shallow Trench Isolation (STI) Wells: Retrograde twin well for low well sheet resistance and better latch-up behavior Triple well, Deep N-Well in option Dual Gate Oxide Vt options: – ULP: UHVt, HVt, SVt, LVt, ULVt, Native – ULL: UHVt, HVt, SVt, LVt, ULVt, EHVt, Native SRAM: – ULP: GL SRAM – ULL: GL SRAM, ULL SRAM, ELL SRAM High-R and unsilicided OD resistors NW resistors: NW resistor within OD and NW resistor under STI Temperature range: -40C to 125C junction temperature # of metals: 3 to 10 Cu + AlRDL Top metal: Up to 35KA (please check with eptsmc@imec.be) HVMOS: – I/O 1.8V based HVMOS in ULL/ULP – I/O 2.5V based HVMOS in ULL only CMP on STI, contact, metals, vias, passivation |
Wafer size | 12 inch
|
Deliverables | 100 dies, no wafer
|
Design tools | PDK: TSMC iPDK
|
Verification tools DRC | Cadence, Siemens EDA, Synopsys
|
Verification tools LVS
| Cadence, Siemens EDA, Synopsys
|
Parasitic extraction tools
| Cadence, Siemens EDA, Synopsys
|
P&R tools
| Cadence, Synopsys
|
I/O | 0.8V/1.8V or 0.8V/2.5V. 2.5V overdrive to 3.3V 2.5V underdrive to 1.8V 1.8V underdrive to 1.5V 1.8V underdrive to 1.2V |
SRAM | ULP: SRAM compilers by TSMC ULL: SRAM compilers by ARM |
MPW block size
| 6 mm² (on silicon)
|
Mini@sic characteristics
| Not supported
|
EUROPRACTICE offers a flagship technology TSMC 16nm CMOS logic or RF FinFET Compact 0.8V/1.8V. It provides superior performance and power consumption advantage for next generation high-end mobile computing, network communication, consumer and automotive electronic applications.
16nm CMOS logic FinFET Compact | |
|---|---|
Technology characteristics | Shrink technology: 2% shrink Core voltage: 0.8V I/O voltage: 1.8V Shallow Trench Isolation (STI) Triple well, Deep N-Well in option Dual gate oxide Vt options: hvt, svt, lvt, ulvt, low noise vt 5V HVMOS TiN High Resistor N+/P+ metal gate allows symmetrical design of NMOS and PMOS devices Temperature range: -40C to 125C # of metals: 6 to 13 Cu plus last metal level in Al pad Interconnect dielectric: ELK HD MiM capacitors Passivation: dual layers |
Wafer size | 12 inch
|
Deliverables | 100 dies, no wafer
|
Design tools | PDK: TSMC iPDK
|
Simulation tools | HSPICE, Eldo, Spectre
|
Verification tools DRC | Cadence, Siemens EDA, Synopsys
|
Verification tools LVS
| Cadence, Siemens EDA, Synopsys
|
Parasitic extraction tools
| Cadence, Siemens EDA, Synopsys
|
P&R tools
| Cadence, Siemens EDA, Synopsys
|
Foundry IP
| 9-track, 7.5-track body biased core cell libraries with gate lengths of 16, 20 and 24nm 0.8V/1.8V hybrid staggered I/O library SRAM compilers by TSMC, ARM_Artisan, ARM ltd, GUC, Synopsys |
MPW block size
| 4 mm²
|
Mini@sic characteristics
| |
TSMC 7nm FinFET offers industry-leading power and performance for a broad array of applications, ranging from high-to-mid end mobile,
consumer applications, AI, networking, 5G infrastructure, GPU, and high-performance computing.
Since it is classified as a leading node technology, access to it is subject to review and approval by TSMC.
7nm CMOS logic FinFET Compact | |
|---|---|
Technology characteristics | Shrink technology: NO Core voltage: 0.75V I/O voltage: 1.8V Shallow Trench Isolation (STI) Triple well, Deep N-Well in option Dual gate oxide Vt options: svt, lvt, ulvt NW, TiN High Resistor N+/P+ metal gate allows symmetrical design of NMOS and PMOS devices Temperature range: -40C to 125C # of metals: 9 to 15 Cu plus last metal level in Al pad Interconnect dielectric: ELK MOM capacitors HD MiM capacitors for decoupling Passivation: dual layers |
Wafer size | 12 inch
|
Deliverables | 100 dies, no wafer
|
Design tools | PDK: TSMC iPDK
|
Simulation tools | HSPICE, Eldo, Spectre
|
Verification tools DRC | Cadence, Siemens EDA, Synopsys
|
Verification tools LVS
| Cadence, Siemens EDA, Synopsys
|
Parasitic extraction tools
| Cadence, Siemens EDA, Synopsys
|
P&R tools
| Cadence, Siemens EDA, Synopsys
|
Foundry IP
| Cell height 240nm or 300nm, body biased PODE core cell libraries with gate lengths of 8 and 11nm 0.75V/1.8V, general purpose I/O library in combination with solder bump or Cu-pillar (no wirebond) SRAM compilers |
MPW block size
| 2 mm²
|
Mini@sic characteristics
| Not supported
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Discover TSMC metal stacks options and mini@sic options available through EUROPRACTICE:
