ASIC PACKAGING

ASIC packaging

STANDARD PACKAGING

LEAD TIME

Since the lead time of assembly houses has increased over the last year, the Europractice packaging lead time is now also slightly longer: up to 6 weeks.

ACCESS CONDITIONS

It is important that our customers access packaging services via the same Europractice partner that was responsible for the fabrication of their prototypes. For instance, if you had your prototypes fabricated via imec, you should also access packaging services through imec.

PRICE STRUCTURE

All packages require a setup cost of €460 per bonding diagram.

The prices below are valid for all packages and bonding of designs with the following requirements:

Pad pitch of min. 90 microns
Wire bonding length up to 6mm. If wirebond length is more than 6mm, 30% additional charge applies based on unit price
Passivation openings of 76µm x 76µm or larger. Additional charges apply for designs with passivation openings less than 76µm x 76µm:
- passivation openings 61µm to 75µm: 325 EUR
- passivation openings 51µm to 60µm: 475 EUR
- passivation openings 40µm to 50µm: 590 EUR

Minimum package order depends on the Europractice partner you work with.

Fraunhofer and imec: minimum quantity is 10 packages per design.
CMP: minimum quantity is 5 packages per design.

Fixed set-up cost for glass sealing for up to 30 pieces: 890 EUR.

Please make sure you follow ASIC Package Design Rules and download the GDS file containing available packages within Europractice:

Europractice packaging offer is wider than the options listed below. Please contact us for more details.

As mentioned above in PRICE STRUCTURE, all packages require a setup cost of €440 per bonding diagram.

Some assemblies may lead to further additional charges depending on the complexity. In the case of non-standard assembly some setup samples may be needed for validation. These setup parts may not be suited for further usage.

This is not a full list. More packages are available on request.

Standard Ceramic Packaging: Price per one item
Type	EUR
Dual-in-line
DIL 16	65
DIL 18	92
DIL 24	84
DIL 28	89
DIL 40	93
DIL 48	110
Ceramic Small Outline Integrated Circuit
CSOIC 16	120
CSOIC20	138
CSOIC24	144
CSOIC 28	149
C-Leadless Chip Carriers
CLCC 44	99
CLCC 68	130
CLCC 84	133
J-Leaded Chip Carriers
JLCC44	111
JLCC 68	144
JLCC 84	165
Ceramic Pin Grid Array
CPGA 100	163
CPGA 120	181
CPGA 144	207
CPGA 208	317
CPGA 256	414
Ceramic Quad Flat Package
CERQUAD FP 64	156
CERQUAD FP 120	218
CERQUAD FP 128	220
CERQUAD FP 160	251
CERQUAD FP 208	315

The silicon thickness for “Open-Pak” plastic types may not exceed 280µm (11 mils). Please check it with the partner responsible for the technology in question.
For the QFN packages, Europractice uses default epoxy sealed lids. “Taped” lids can be provided on request and responsibility of the customer. However, we cannot guarantee that “taped” lids do not come loose during transport. Europractice takes no responsibility in this case.

This is not a full list. More packages are available on request.

Plastic “Open-Pak” Packages: Price per one item
Type	EUR
Small Outline IC
SOIC 16	120
SOIC 20	138
SOIC 24	144
SOIC 28	149
Quad-Flat No-leads
QFN 12 (4×4)	79
QFN 16 (5×5)	85
QFN 20 (5×5)	92
QFN 24 (5×5)	99
QFN 24 (6×6)	99
QFN 28 (4×4)	105
QFN 28 (5×5)	105
QFN 28 (6×6)	106
QFN 32 (5×5)	116
QFN 32 (7×7)	116
QFN 36 (6×6)	122
QFN 40 (5×5)	133
QFN 40 (6×6)	133
QFN 48 (7×7)	136
QFN 56 (8×8)	138
QFN 64 (9×9)	177
QFN 80 (12×12)	185
QFN 88 (10×10)	194
QFN 100 (12×12)	218

Plastic packages for small quantities (<100 units)

applicable to standard plastic packages available as open-tool on the market
assembly cost on request
extra delivery time

CUSTOMIZED PACKAGING

Novel applications and prototypes sometimes need customised assembly. Therefore, together with standard packaging, Europractice offers a wide range of custom solutions, ranging from simple custom wirebonds to complex multilayer optoelectronic sub-assembly.

To benefit from customized packaging solutions, please contact one of the Europractice partners:

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